NB100LVEP221 データシートの表示（PDF） - ON Semiconductor
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NB100LVEP221 Datasheet PDF : 11 Pages
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NB100LVEP221
PACKAGE DIMENSIONS
LQFP 52 LEAD EXPOSED PAD PACKAGE
CASE 848H−01
ISSUE A
SCALE 1:1
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI
M
4 PL
M/2
AJ AJ
0.20 (0.008) T X−Y Z
Y14.5M, 1982.
2. CONTROLLING DIMENSION: MM.
3. DATUM PLANE E" IS LOCATED AT BOTTOM OF
LEAD AND IS COINCIDENT WITH THE LEAD
−Z−
WHERE THE LEAD EXITS THE PLASTIC BODY AT
THE BOTTOM OF THE PARTING PLANE.
52
40
4. DATUM X", Y" AND Z" TO BE DETERMINED AT
DATUM PLANE DATUM E".
1
39
5. DIMENSIONS M AND L TO BE DETERMINED AT
SEATING PLANE DATUM T".
6. DIMENSIONS A AND B DO NOT INCLUDE MOLD
PROTRUSION. ALLOWABLE PROTRUSION IS 0.25
−X−
L
L/2
PLATING
−Y−
AA
ÉÉÉÉ B
ÉÉÇÇÉÉÇÇÉÉÇÇÉÉÇÇ AB
BASE
METAL
J
B/2
D
REF
(0.010) PER SIDE. DIMENSIONS A AND B DO
INCLUDE MOLD MISMATCH AND ARE
DETERMINED AT DATUM PLAND E".
7. DIMENSION D DOES NOT INCLUDE DAMBAR
PROTRUSION. ALLOWABLE DAMBAR
PROTRUSION SHALL NOT CAUSE THE LEAD
WIDTH TO EXCEED THE MAXIMUM D DIMENSION
BY MORE THAN 0.08 (0.003). DAMBAR CANNOT
BE LOCATED ON THE LOWER RADIUS OR THE
FOOT. MINIMUM SPACE BETWEEN PROTRUSION
AND ADJACENT LEAD OR PROTRUSION 0.07
(0.003).
13
27
0.08 (0.003) M Y T−U Z
MILLIMETERS
INCHES
14
26
DIM MIN MAX MIN MAX
DETAIL AJ−AJ
A 10.00 BSC
0.394 BSC
A/2
B 10.00 BSC
0.394 BSC
A
0.20 (0.008) E X−Y Z
C 1.30 1.50 0.051 0.059
D 0.22 0.40 0.009 0.016
F 0.45 0.75 0.018 0.030
DETAIL AH
−E−
G
0.65 BSC
0.026 BSC
H
1.00 REF
0.039 BSC
J 0.09 0.20 0.004 0.008
K 0.05 0.20 0.002 0.008
−T− AG
SEATING
PLANE
G 48 PL
AG
0.10 (0.004) T
L
12.00 BSC
0.472 BSC
M 12.00 BSC
0.472 BSC
N
0.20 REF
0.008 REF
P 0_ 7_ 0 _ 7_
R
0 _ −−−
0 _ −−−
D 52 PL
0.08 (0.003) M T X−Y Z
V
0.05 (0.002) S
R
AC
S −−− 1.70 −−− 0.067
V
12 _REF
W
12 _REF
12 _REF
12 _REF
AA 0.20 0.35 0.008 0.014
AB 0.07 0.16 0.003 0.006
AC 0.08 0.20 0.003 0.008
AD
AD 4.58 4.78 0.180 0.188
EXPOSED PAD 14
26
SC
AE 4.58 4.78 0.180 0.188
13
27
W
K
N
P
0.25
F
GAGE
AE
H
PLANE
DETAIL AH
1
52
VIEW AG−AG
39
40
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