NB6L14M
PACKAGE DIMENSIONS
PIN 1
LOCATION
D
ÇÇÇÇÇÇ
16 PIN QFN
MN SUFFIX
CASE 485G−01
A
ISSUE C
B
E
0.15 C
0.15 C
TOP VIEW
0.10 C
16 X 0.08 C
(A3)
SIDE VIEW
A
SEATING
PLANE
A1
C
16X L
NOTE 5
16X K
D2
e
5
8
EXPOSED PAD
4
9
E2
e
1
12
NOTES:
1. DIMENSIONING AND TOLERANCING PER
ASME Y14.5M, 1994.
2. CONTROLLING DIMENSION: MILLIMETERS.
3. DIMENSION b APPLIES TO PLATED
TERMINAL AND IS MEASURED BETWEEN
0.25 AND 0.30 MM FROM TERMINAL.
4. COPLANARITY APPLIES TO THE EXPOSED
PAD AS WELL AS THE TERMINALS.
5. Lmax CONDITION CAN NOT VIOLATE 0.2 MM
MINIMUM SPACING BETWEEN LEAD TIP
AND FLAG
MILLIMETERS
DIM MIN MAX
A 0.80 1.00
A1 0.00 0.05
A3 0.20 REF
b 0.18 0.30
D 3.00 BSC
D2 1.65 1.85
E 3.00 BSC
E2 1.65 1.85
e 0.50 BSC
K 0.18 TYP
L 0.30 0.50
16
13
16X b
0.10 C A B BOTTOM VIEW
0.05 C NOTE 3
0.575
0.022
SOLDERING FOOTPRINT*
3.25
0.128
0.30
0.012
EXPOSED PAD
3.25
0.128
1.50
0.059
0.30
0.50
0.012
ǒ Ǔ 0.02
SCALE 10:1
mm
inches
*For additional information on our Pb−Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
http://onsemi.com
10