NC33395T データシートの表示（PDF） - Motorola => Freescale
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NC33395T Datasheet PDF : 16 Pages
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Freescale Semiconductor, Inc.
10.3
7.6
7.4
1
PIN 1 ID
B
B
16
5.15
2X 16 TIPS
0.3 A B C
A
A
PACKAGE DIMENSIONS
C
B
59
32
4
11.1
9 10.9
17
DWB SUFFIX
32-TERMINAL SOICW
PLASTIC PACKAGE
CASE 1324-02
ISSUE A
2.65
2.35
30X
0.65
CL
A
SEATING
PLANE
NOTES:
1. ALL DIMENSIONS ARE IN MILLIMETERS.
2. DIMENSIONING AND TOLERANCING PER ASME
Y14.5M, 1994.
3. DATUMS B AND C TO BE DETERMINED AT THE
PLANE WHERE THE BOTTOM OF THE LEADS EXIT
THE PLASTIC BODY.
4. THIS DIMENSION DOES NOT INCLUDE MOLD FLASH,
PROTRUSION OR GATE BURRS. MOLD FLASH,
PROTRUSION OR GATE BURRS SHALL NOT EXCEED
0.15 MM PER SIDE. THIS DIMENSION IS DETERMINED
AT THE PLANE WHERE THE BOTTOM OF THE LEADS
EXIT THE PLASTIC BODY.
5. THIS DIMENSION DOES NOT INCLUDE INTERLEAD
FLASH OR PROTRUSIONS. INTERLEAD FLASH AND
PROTRUSIONS SHALL NOT EXCEED 0.25 MM PER
SIDE. THIS DIMENSION IS DETERMINED AT THE
PLANE WHERE THE BOTTOM OF THE LEADS EXIT
THE PLASTIC BODY.
6. THIS DIMENSION DOES NOT INCLUDE DAMBAR
PROTRUSION. ALLOWABLE DAMBAR PROTRUSION
SHALL NOT CAUSE THE LEAD WIDTH TO EXCEED
0.4 MM PER SIDE. DAMBAR CANNOT BE LOCATED
ON THE LOWER RADIUS OR THE FOOT. MINIMUM
SPACE BETWEEN PROTRUSION AND ADJACENT
LEAD SHALL NOT LESS THAN 0.07 MM.
7. EXACT SHAPE OF EACH CORNER IS OPTIONAL.
8. THESE DIMENSIONS APPLY TO THE FLAT SECTION
OF THE LEAD BETWEEN 0.10 MM AND 0.3 MM FROM
THE LEAD TIP.
9. THE PACKAGE TOP MAY BE SMALLER THAN THE
PACKAGE BOTTOM. THIS DIMENSION IS
DETERMINED AT THE OUTERMOST EXTREMES OF
THE PLASTIC BODY EXCLUSIVE OF MOLD FLASH,
TIE BAR BURRS, GATE BURRS AND INTER-LEAD
FLASH, BUT INCLUDING ANY MISMATCH BETWEEN
THE TOP AND BOTTOM OF THE PLASTIC BODY.
32X
0.10 A
(0.29)
BASE METAL
0.25
0.19
(0.203)
0.38
6
0.22
PLATING
0.13 M C A M B 8
SECTION A-A
ROTATED 90 CLOCKWISE
R0.08 MIN
0.25
0
GAUGE PLANE
MIN
0.9
8
0
0.5
SECTION B-B
0.29
0.13
33395
14
For More Information OMnOTTOhRiOsLPArAoNdAuLOcGt,INTEGRATED CIRCUIT DEVICE DATA
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