NBXDDA016LN1TAG データシートの表示（PDF） - ON Semiconductor

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NBXDDA016LN1TAG

3.3 V, 133.33 MHz/137.93 MHz Dual Frequency CML Clock Oscillator

ON Semiconductor 

NBXDDA016, NBXDDB016

Table 8. RELIABILITY COMPLIANCE

Parameter

ÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁ Shock

ÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁ Solderability

ÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁ Vibration

Solvent Resistance

ÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁ Thermal Shock

ÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁ Moisture Level Sensitivity

Standard

Mechanical

Mechanical

Mechanical

Mechanical

Environment

Environment

Method

MIL−STD−833, Method 2002, Condition B

MIL−STD−833, Method 2003

MIL−STD−833, Method 2007, Condition A

MIL−STD−202, Method 215

MIL−STD−833, Method 1011, Condition A

MSL1 260°C per IPC/JEDEC J−STD−020D

VTT = VDD

NBXDDB016/NBXDDA016

Driver

Device

CLK

CLK

50 W

Z = 50 W

Z = 50 W

50 W

D

Receiver

Device

D

Figure 5. Typical CML Termination for Output Driver and Device Evaluation

(See Application Note AND8173 − Termination of CML Devices)

Temperature (°C)

260

217

temp. 260°C

20 − 40 sec. max.

peak

3°C/sec. max.

ramp−up

175

150

pre−heat

reflow

6°C/sec. max.

cooling

Time

60180 sec.

60150 sec.

Figure 6. Recommended Reflow Soldering Profile

http://onsemi.com

5

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