NBXSPA008 データシートの表示（PDF） - ON Semiconductor
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NBXSPA008 Datasheet PDF : 6 Pages
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NBXSPA008
Table 7. RELIABILITY COMPLIANCE
Parameter
ÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁ Shock
ÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁ Solderability
ÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁ Vibration
ÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁ Solvent Resistance
ÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁ Resistance to Soldering Heat
ÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁ Thermal Shock
ÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁ Moisture Resistance
Standard
Mechanical
Mechanical
Mechanical
Mechanical
Mechanical
Environment
Environment
Method
MIL−STD−833, Method 2002, Condition B
MIL−STD−833, Method 2003
MIL−STD−833, Method 2007, Condition A
MIL−STD−202, Method 215
MIL−STD−203, Method 210, Condition I or J
MIL−STD−833, Method 1001, Condition A
MIL−STD−833, Method 1004
NBXSPA008
Driver
Device
CLK
CLK
Zo = 50 W
Zo = 50 W
100 W
D
Receiver
Device
D
Figure 4. Typical Termination for Output Driver and Device Evaluation
Temperature (°C)
260
217
temp. 260°C
20 − 40 sec. max.
peak
3°C/sec. max.
6°C/sec. max.
ramp−up
175
150
pre−heat
cooling
reflow
Time
60180 sec.
60150 sec.
Figure 5. Recommended Reflow Soldering Profile
http://onsemi.com
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