NCP1234 データシートの表示（PDF） - ON Semiconductor

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NCP1234

Fixed Frequency Current Mode Controller for Flyback Converters

ON Semiconductor 

NCP1234

MAXIMUM RATINGS

Rating

Symbol

Value

Unit

Supply Pin (pin 6) (Note 2)

Voltage range

Current range

High Voltage Pin (pin 8) (Note 2)

Voltage range

Current range

Driver Pin (pin 5) (Note 2)

Voltage range

Current range

All other pins (Note 2)

Voltage range

Current range

Thermal Resistance SOIC−7

Junction−to−Air, low conductivity PCB (Note 3)

Junction−to−Air, medium conductivity PCB (Note 4)

Junction−to−Air, high conductivity PCB (Note 5)

VCCMAX

ICCMAX

VHVMAX

IHVMAX

VDRVMAX

IDRVMAX

VMAX

IMAX

RJ−A

–0.3 to 28

30

–0.3 to 500

20

–0.3 to 20

1000

–0.3 to 10

10

162

147

115

V

mA

V

mA

V

mA

V

mA

C/W

Temperature Range

Operating Junction Temperature

Storage Temperature Range

ESD Capability (Note 1)

Human Body Model (All pins except HV)

Machine Model

C

TJMAX

TSTRGMAX

−40 to +150

−60 to +150

V

2000

200

Stresses exceeding Maximum Ratings may damage the device. Maximum Ratings are stress ratings only. Functional operation above the

Recommended Operating Conditions is not implied. Extended exposure to stresses above the Recommended Operating Conditions may affect

device reliability.

1. This device series contains ESD protection and exceeds the following tests:

Human Body Model 2000 V per JEDEC standard JESD22, Method A114E

Machine Model Method 200 V per JEDEC standard JESD22, Method A115A

2. This device contains latch−up protection and exceeds 100 mA per JEDEC Standard JESD78

3. As mounted on a 80 x 100 x 1.5 mm FR4 substrate with a single layer of 50 mm2 of 2 oz copper traces and heat spreading area. As specified

for a JEDEC 51−1 conductivity test PCB. Test conditions were under natural convection or zero air flow.

4. As mounted on a 80 x 100 x 1.5 mm FR4 substrate with a single layer of 100 mm2 of 2 oz copper traces and heat spreading area. As specified

for a JEDEC 51−2 conductivity test PCB. Test conditions were under natural convection or zero air flow.

5. As mounted on a 80 x 100 x 1.5 mm FR4 substrate with a single layer of 650 mm2 of 2 oz copper traces and heat spreading area. As specified

for a JEDEC 51−3 conductivity test PCB. Test conditions were under natural convection or zero air flow.

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