NCP5111DR2G データシートの表示（PDF） - ON Semiconductor

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NCP5111DR2G

High Voltage, High and Low Side Driver

ON Semiconductor 

NCP5111

PIN DESCRIPTIONS

Pin No. Pin Name

1

VCC

2

IN

3

GND

4

DRV_LO

5

NC

6

BRIDGE

7

DRV_HI

8

VBOOT

Pin Function

Low side and main power supply

Logic Input

Ground

Low side gate drive output

Not Connected

Bootstrap return or high side floating supply return

High side gate drive output

Bootstrap power supply

MAXIMUM RATINGS

Rating

Symbol

Value

Unit

VCC

VCC_transient

VBRIDGE

VBRIDGE

VBOOT−VBRIDGE

VDRV_HI

Main power supply voltage

Main transient power supply voltage:

IVCC_max = 5 mA during 10 ms

VHV: High Voltage BRIDGE pin

Allowable Negative Bridge Pin Voltage for IN_LO Signal Propagation to DRV_LO

VHV: Floating supply voltage

VHV: High side output voltage

VDRV_LO

dVBRIDGE/dt

VIN

Low side output voltage

Allowable output slew rate

Inputs IN

ESD Capability:

− HBM model (all pins except pins 6−7−8)

− Machine model (all pins except pins 6−7−8)

−0.3 to 20

23

−1 to 600

−10

−0.3 to 20

VBRIDGE − 0.3 to

VBOOT + 0.3

−0.3 to VCC + 0.3

50

−1.0 to VCC + 0.3

2

200

V

V

V

V

V

V

V

V/ns

V

kV

V

Latchup capability per JEDEC JESD78

RqJA

Power dissipation and Thermal characteristics

PDIP−8: Thermal Resistance, Junction−to−Air

SO−8: Thermal Resistance, Junction−to−Air

°C/W

100

178

TSTG

Storage Temperature Range

−55 to +150

°C

TJ_max

Maximum Operating Junction Temperature

+150

°C

Stresses exceeding those listed in the Maximum Ratings table may damage the device. If any of these limits are exceeded, device functionality

should not be assumed, damage may occur and reliability may be affected.

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