NCP508SQ30T1G データシートの表示（PDF） - ON Semiconductor
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NCP508SQ30T1G Datasheet PDF : 15 Pages
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NCP508
Cin = Cout = 1 mF
Vin = VEN = 2.8 V
Vout = 2.5 V
TA = 25°C
Ilimit = 180 mA
0.06
0.05
0.04
0.03
0.02
0.01
VEN = Vin
Cin = Cout = 1 mF
TA = 85°C
50 mA/div
500 ms/div
0
0 1 2 3 4 5 6 7 8 9 10 11 12 13
Figure 32. Hard Short−Circuit Current (by Copper Wires)
Vin, INPUT VOLTAGE (V)
Figure 33. Measured Power Operating Area,
1.5 V, TA = 855C, Vout_drop = max 0.1 V
33 x 26 mm
Figure 34. Evaluation Board
350
0.25
300
PD
0.2
250
200
0.15
qJA
150
0.1
100
0.05
50
PCB Copper Thickness = 1.0 oz
0
0
0 100 200 300 400 500 600 700 800 900 1000
COPPER HEAT SPREADER AREA (mm2)
Figure 35. SC70−5 Thermal Resistance vs.
Copper Heat Spreader Area
400
350
300
250
200
150
100
PCB Copper Thickness = 1.0 oz
50
0 100 200 300 400 500 600 700 800 900
PCB COPPER HEAT SPREADER AREA (mm2)
Figure 36. WDFN6 Thermal Resistance vs.
Copper Heat Spreader Area
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