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NCP5608 データシートの表示(PDF) - ON Semiconductor

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NCP5608
ON-Semiconductor
ON Semiconductor ON-Semiconductor
NCP5608 Datasheet PDF : 16 Pages
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NCP5608
MAXIMUM RATINGS
Rating
Symbol
Value
Unit
Power Supply
Digital Input Voltage
Digital Input Current
Vbat
7.0
V
SDA, SCL
−0.3 v Vin v VBAT + 0.3
V
1.0
mA
ESD Capability (Note 4)
Human Body Model (HBM)
Machine Model (MM)
VESD
2.0
kV
200
V
QFN24 Package
Power Dissipation @ TA = +85°C (Note 5)
Thermal Resistance, Junction−to−Air (according to JEDEC/EIA JESD51−12)
Operating Ambient Temperature Range
Operating Junction Temperature Range
Maximum Junction Temperature
Storage Temperature Range
Latchup Current Maximum Rating (per JEDEC standard: JESD78) Class II
PD
RqJA
TA
TJ
TJmax
Tstg
250
160
−40 to +85
−40 to +125
+150
−65 to +150
"100
mW
°C/W
°C
°C
°C
°C
mA
Moisture Sensitivity Level (Note 6)
MSL
1
Stresses exceeding Maximum Ratings may damage the device. Maximum Ratings are stress ratings only. Functional operation above the
Recommended Operating Conditions is not implied. Extended exposure to stresses above the Recommended Operating Conditions may affect
device reliability.
4. This device series contains ESD protection and exceeds the following tests:
Human Body Model (HBM): JESD22−A114.
Machine Model (MM): JESD22−A115.
5. The maximum package power dissipation limit must not be exceeded.
6. Moisture Sensitivity Level (MSL): per IPC/JEDEC standard: J−STD−020A.
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