NCV8570(2009) データシートの表示（PDF） - ON Semiconductor
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NCV8570 Datasheet PDF : 12 Pages
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NCV8570
PACKAGE DIMENSIONS
TSOP−5
CASE 483−02
ISSUE H
NOTES:
1. DIMENSIONING AND TOLERANCING PER
NOTE 5
D 5X
ASME Y14.5M, 1994.
2. CONTROLLING DIMENSION: MILLIMETERS.
2X 0.10 T
0.20 C A B
3. MAXIMUM LEAD THICKNESS INCLUDES
LEAD FINISH THICKNESS. MINIMUM LEAD
2X
0.20 T
5
4 BS
1 23
THICKNESS IS THE MINIMUM THICKNESS
M
OF BASE MATERIAL.
4. DIMENSIONS A AND B DO NOT INCLUDE
MOLD FLASH, PROTRUSIONS, OR GATE
K
BURRS.
5. OPTIONAL CONSTRUCTION: AN
L
G
DETAIL Z
ADDITIONAL TRIMMED LEAD IS ALLOWED
IN THIS LOCATION. TRIMMED LEAD NOT TO
EXTEND MORE THAN 0.2 FROM BODY.
A
MILLIMETERS
DIM MIN MAX
DETAIL Z
A
3.00 BSC
J
B
1.50 BSC
C
C 0.90 1.10
0.05
H
SEATING
PLANE
D 0.25 0.50
G
0.95 BSC
H 0.01 0.10
T
J 0.10 0.26
K 0.20 0.60
L 1.25 1.55
SOLDERING FOOTPRINT*
M
0 _ 10 _
S 2.50 3.00
0.95
0.037
1.9
0.074
2.4
0.094
1.0
0.039
0.7
0.028
ǒ Ǔ SCALE 10:1
mm
inches
*For additional information on our Pb−Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
http://onsemi.com
11
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