NDS8425 データシートの表示（PDF） - Fairchild Semiconductor
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NDS8425 Datasheet PDF : 10 Pages
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Typical Electrical and Thermal Characteristics (continued)
50
VDS = 5V
40
30
TJ= -55°C
25°C
20
125°C
10
0
0
5
10
15
20
25
I , DRAIN CURRENT (A)
D
Figure 13. Transconductance Variation with Drain
Current and Temperature.
2.5
1a
2
1.5
1b
1c
1
0.5
0
4.5"x5" FR-4 Board
TA = 25o C
Still Air
0.2
0.4
0.6
0.8
1
2oz COPPER MOUNTING PAD AREA (in 2 )
Figure 14. SO-8 Maximum Steady-State Power
Dissipation versus Copper Mounting Pad Area.
8
1a
7
6
1b
1c
5
4
0
4.5"x5" FR-4 Board
TA = 25 oC
Still Air
VGS = 4.5V
0.2
0.4
0.6
0.8
1
2oz COPPER MOUNTING PAD AREA (in2 )
Figure 15. Maximum Steady-State Drain
Current versus Copper Mounting Pad
Area.
50
20
10
RDS(ON) LIMIT
5
2
1
0.5
VGS = 4.5V
0.1 SINGLE PULSE
RθJA = See Note 1c
TAA = 25°C
1ms
10ms
1s100ms
10s
DC
0.01
0.1 0.2
0.5
1
2
5
10
VDS , DRAIN-SOURCE VOLTAGE (V)
20 30
Figure 16. Maximum Safe Operating Area.
1
0 .5
0 .2
0 .1
0 .0 5
0 .0 2
0 .0 1
0 .0 0 5
0 .0 0 2
0 .0 0 1
0.0001
D = 0.5
0.2
0.1
0.05
0.02
0.01
Single Pulse
0 .001
0 .0 1
0 .1
1
t1 , TIME (sec)
R θJA (t) = r(t) * RθJA
R θJA = See Note 1c
P(pk)
t1
t2
TJ - TA = P * R θJA (t)
Duty Cycle, D = t 1 / t 2
10
100
300
Figure 17. Transient Thermal Response Curve.
Note: Thermal characterization performed using the conditions described in note 1c. Transient thermal response will change
depending on the circuit board design.
NDS8425 Rev. C
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