NDT456P データシートの表示（PDF） - Fairchild Semiconductor
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NDT456P Datasheet PDF : 7 Pages
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Typical Thermal Characteristics
18
VDS = -5V
15
12
TJ = -55°C
25°C
125°C
9
6
3
0
0
-2
-4
-6
-8
-10
I D, DRAIN CURRENT (A)
Figure 13. Transconductance Variation with Drain
Current and Temperature.
3 .5
3
2 .5
2
1 .5
1b
1c
1
0 .5
0
1a
4.5"x5" FR-4 Board
TA = 25o C
Still Air
0 .2
0 .4
0 .6
0 .8
1
2 o z COPPER M O U N T ING PAD AREA (in 2 )
Figure 14. SOT-223 Maximum Steady-State Power
Dissipation versus Copper Mounting Pad
Area.
10
8
1a
6
1b
4 1c
2
0
0
4.5"x5" FR-4 Board
o
TA = 25 C
Still Air
VGS = -10V
0.2
0.4
0.6
0.8
1
2oz COPPER MOUNTING PAD AREA (in2 )
Figure 15. Maximum Steady-State Drain
Current versus Copper Mounting Pad
Area.
40
20
10
RDS(ON) LIMIT
3
1
0.3
VGS = -10V
0.1 SINGLE PULSE
RθJA= See Note 1c
0.03
TA = 25°C
100us
1ms
10ms
1s100ms
D1C0s
0.01
0.1 0.2
0.5 1
2
5 10
- VDS , DRAIN-SOURCE VOLTAGE (V)
30 50
Figure 16. Maximum Safe Operating Area.
1
0 .5
D = 0.5
0 .2
0 .1
0 .05
0.2
0 .1
0 .0 5
0 .02
0 .01
0 .0 0 5
0 .0 0 2
0 .0 0 1
0 .0 0 0 1
0 .0 2
0 .0 1
Single Pulse
0 .0 0 1
0 .01
0 .1
1
t 1 , TIM E (sec)
R θJA (t) = r(t) * R θJA
R θJA = See Note 1 c
P(p k)
t1
t2
TJ - TA = P * R θJA (t)
Duty Cycle, D = t 1 / t 2
10
100
300
Figure 17. Transient Thermal Response Curve.
Note: Thermal characterization performed using the conditions described in note 1c. Transient thermal
response will change depending on the circuit board design.
NDT456P Rev. F
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