NLAS325(2002) データシートの表示（PDF） - ON Semiconductor
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NLAS325 Datasheet PDF : 12 Pages
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NLAS325
–X–
A
8
5
–Y–
B
L
1
4
P
G
–T–
SEATING
PLANE
C
K
D
0.10 (0.004) M T X Y
PACKAGE DIMENSIONS
US8
US SUFFIX
CASE 493–01
ISSUE O
J
DETAIL E
R
S
U
0.10 (0.004) T
H
N
V
F
DETAIL E
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
2. CONTROLLING DIMENSION: MILLIMETERS
3. DIMENSION A" DOES NOT INCLUDE MOLD
FLASH, PROTRUSION OR GATE BURR. MOLD
FLASH. PROTRUSION AND GATE BURR SHALL
NOT EXCEED 0.140 MM (0.0055") PER SIDE.
4. DIMENSION B" DOES NOT INCLUDE
INTER-LEAD FLASH OR PROTRUSION.
INTER-LEAD FLASH AND PROTRUSION SHALL
NOT E3XCEED 0.140 (0.0055") PER SIDE.
5. LEAD FINISH IS SOLDER PLATING WITH
THICKNESS OF 0.0076-0. 0203 MM. (300-800
INCH).
6. ALL TOLERANCE UNLESS OTHERWISE
SPECIFIED ±0.0508 (0.0002").
R 0.10 TYP
M
MILLIMETERS
INCHES
DIM MIN MAX MIN MAX
A 1.90 2.10 0.075 0.083
B 2.20 2.40 0.087 0.094
C 0.60 0.90 0.024 0.035
D 0.17 0.25 0.007 0.010
F 0.20 0.35 0.008 0.014
G
0.50 BSC
0.020 BSC
H
0.40 REF
0.016 REF
J 0.10 0.18 0.004 0.007
K 0.00 0.10 0.000 0.004
L 3.00 3.20 0.118 0.126
M 0_ 6_ 0_ 6_
N
5 _ 10 _ 5 _ 10 _
P 0.28 0.44 0.011 0.017
R 0.23 0.33 0.009 0.013
S 0.37 0.47 0.015 0.019
U 0.60 0.80 0.024 0.031
V
0.12 BSC
0.005 BSC
3.8
0.5TYP ÉÉÉÉÉÉÉÉÉÉÉÉ 1.8TYPÉÉÉÉÉÉÉÉÉÉÉÉ
0.3 TYP
1.0
(mm)
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