NLAS325 データシートの表示（PDF） - ON Semiconductor
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NLAS325 Datasheet PDF : 10 Pages
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NLAS325
MAXIMUM RATINGS
Symbol
Parameter
Value
Unit
VCC
VI
VO
IIK
IOK
IO
ICC
IGND
TSTG
TL
TJ
qJA
PD
MSL
DC Supply Voltage
DC Input Voltage
DC Output Voltage
DC Input Diode Current
DC Output Diode Current
DC Output Sink Current
DC Supply Current per Supply Pin
DC Ground Current per Ground Pin
Storage Temperature Range
Lead Temperature, 1.0 mm from Case for 10 Seconds
Junction Temperature under Bias
Thermal Resistance (Note 1)
Power Dissipation in Still Air at 85°C
Moisture Sensitivity
VI < GND
VO < GND
*0.5 to )7.0
*0.5 to )7.0
*0.5 to )7.0
*50
*50
$50
$100
$100
*65 to )150
260
)150
250
250
Level 1
V
V
V
mA
mA
mA
mA
mA
°C
°C
°C
°C/W
mW
FR
VESD
Flammability Rating
ESD Withstand Voltage
Oxygen Index: 28 to 34 UL 94 V−0 @ 0.125 in
Human Body Model (Note 2)
> 2000
V
Machine Model (Note 3)
> 200
Charged Device Model (Note 4)
N/A
Stresses exceeding Maximum Ratings may damage the device. Maximum Ratings are stress ratings only. Functional operation above the
Recommended Operating Conditions is not implied. Extended exposure to stresses above the Recommended Operating Conditions may affect
device reliability.
1. Measured with minimum pad spacing on an FR4 board, using 10 mm−by−1 inch, 2−ounce copper trace with no air flow.
2. Tested to EIA/JESD22−A114−A.
3. Tested to EIA/JESD22−A115−A.
4. Tested to JESD22−C101−A.
RECOMMENDED OPERATING CONDITIONS
Symbol
Parameter
VCC
DC Supply Voltage
VIN
Digital Select Input Voltage
VIS
Analog Input Voltage (NC, NO, COM)
TA
Operating Temperature Range
tr, tf
Input Rise or Fall Time, SELECT
VCC = 3.3 V $ 0.3 V
VCC = 5.0 V $ 0.5 V
Min
2.0
GND
GND
*55
0
0
Max
5.5
5.5
VCC
)125
100
20
Unit
V
V
V
°C
ns/V
DEVICE JUNCTION TEMPERATURE VERSUS
TIME TO 0.1% BOND FAILURES
Junction
Temperature °C
Time, Hours
Time, Years
80
1,032,200
117.8
90
419,300
47.9
100
178,700
20.4
110
79,600
9.4
120
37,000
4.2
130
17,800
2.0
140
8,900
1.0
FAILURE RATE OF PLASTIC = CERAMIC
UNTIL INTERMETALLICS OCCUR
1
1
10
100
1000
TIME, YEARS
Figure 2. Failure Rate vs. Time Junction Temperature
http://onsemi.com
2
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