NLU1G86MUTCG(2016) データシートの表示（PDF） - ON Semiconductor
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NLU1G86MUTCG Datasheet PDF : 7 Pages
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NLU1G86
PACKAGE DIMENSIONS
UDFN6, 1.2x1.0, 0.4P
CASE 517AA
ISSUE D
D
PIN ONE
REFERENCE
2X
0.10 C
ÉÉÉÉ
TOP VIEW
2X
0.10 C
0.10 C
10X
0.08 C
SIDE VIEW
1
3
A
B
E
(A3)
A
A1
EDGE OF PACKAGE
L1
DETAIL A
Bottom View
NOTES:
1. DIMENSIONING AND TOLERANCING PER
ASME Y14.5M, 1994.
2. CONTROLLING DIMENSION: MILLIMETERS.
3. DIMENSION b APPLIES TO PLATED TERMINAL
AND IS MEASURED BETWEEN 0.25 AND
0.30 mm FROM TERMINAL.
4. COPLANARITY APPLIES TO THE EXPOSED
PAD AS WELL AS THE TERMINALS.
MILLIMETERS
(Optional)
ÉÉÉÉÉÉ EXPOSED Cu
MOLD CMPD
A3
A1
DETAIL B
DIM MIN MAX
A 0.45 0.55
A1 0.00 0.05
A3 0.127 REF
b 0.15 0.25
D 1.20 BSC
E 1.00 BSC
e 0.40 BSC
L 0.30 0.40
L1 0.00 0.15
L2 0.40 0.50
Side View
(Optional)
SEATING
PLANE
C
MOUNTING FOOTPRINT*
6X
0.42
6X
0.22
5X L
L2
6X b
0.10 C A B
6
0.05 C NOTE 3
4
e
BOTTOM VIEW
0.40
PITCH
1.07
DIMENSIONS: MILLIMETERS
*For additional information on our Pb−Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
www.onsemi.com
5
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