SSM2211
square cm of copper area to the ground pins. It is recommended
that the solder mask and/or silk screen on the PCB traces adja-
cent to the SSM2211 pins be deleted, thus reducing further the
junction to ambient thermal resistance of the package.
COPPER
LEAD-FRAME
1
8
2
7
COPPER PADDLE
3
6
4
5
Figure 49. Thermal Coastline
–14–
REV. 0