SK1010-TP データシートの表示（PDF） - Micro Commercial Components
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SK1010-TP Datasheet PDF : 4 Pages
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NOT RECOMMENDED FOR NEW DESIGNS
MCC
TM
Micro Commercial Components
omponents
20736 Marilla Street Chatsworth
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SK102
THRU
SK1010
Features
• Lead Free Finish/Rohs Compliant (Note1) ("P"Suffix designates
Compliant. See ordering information)
• For Surface Mount Applications
• High Current Capability With Low Forward Voltage
• Easy Pick And Place
• High Temp Soldering: 260°C for 10 Seconds At Terminals
• Halogen free available upon request by adding suffix "-HF"
10 Amp Schottky
Rectifier
20 to 100 Volts
Maximum Ratings
• Operating Temperature: -55°C to +125°C
• Storage Temperature: -55°C to +150°C
• Typical Thermal Resistance; 18°C/W Junction To Lead
DO-214AB
(HSMC) (Round Lead)
H
Cathode Band
MST
Part
Number
SK102
SK103
SK1035
SK104
SK1045
SK105
SK106
SK108
SK1010
Device
Marking
SK102
SK103
SK1035
SK104
SK1045
SK105
SK106
SK108
SK1010
Maximum
Recurrent
Peak Reverse
Voltage
20V
30V
35V
40V
45V
50V
60V
80V
100V
Maximum
RMS
Voltage
14V
21V
24.5V
28V
31.5V
35V
42V
56V
70V
Maximum
DC
Blocking
Voltage
20V
30V
35V
40V
45V
50V
60V
80V
100V
Electrical Characteristics @ 25°C Unless Otherwise Specified
Average Forward
Current
IF(AV)
10.0A TL = 95°C
Peak Forward Surge
IFSM
Current
250A 8.3ms, half sine
Maximum
Instantaneous
Forward Voltage
SK102-1045 VF
SK105-1010
Maximum DC
Reverse Current At
IR
Rated DC Blocking
Voltage
.65V
.85V
IFM = 10.0A;
TJ = 25°C*
1mA TJ = 25°C
20mA TJ = 100°C
Typical Junction
Capacitance
CJ
500pF Measured at
1.0MHz, VR=4.0V
Note: 1. High Temperature Solder Exemptions Applied, see EU Directive Annex 7.
J
A
C
E
D
F
G
INCHES
DIM
MIN
A
.200
B
.177
C
.002
D
---
E
.047
F
.168
G
.309
H
.239
J
.234
DIMENSIONS
MAX
.214
.203
.005
.02
.056
.179
.322
.243
.240
MM
MIN
5.08
4.70
.05
---
1.20
4.27
7.85
6.08
5.95
B
MAX
5.43
5.30
.13
.51
1.42
4.55
8.18
6.18
6.10
NOTE
SUGGESTED SOLDER
PAD LAYOUT
0.190’
0.200”
0.070”
www.mccsemi.com
Revision: C
1 of 4
2013/01/01
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