MC14099B データシートの表示（PDF） - Motorola => Freescale
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MC14099B Datasheet PDF : 9 Pages
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–A–
16
1
OUTLINE DIMENSIONS
D SUFFIX
PLASTIC SOIC PACKAGE
CASE 751B–05
ISSUE J
9
–B– P 8 PL
8
0.25 (0.010) M B S
G
–T– SEATING
PLANE
K
C
D 16 PL
0.25 (0.010) M T B S A S
F
R X 45_
M
J
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
2. CONTROLLING DIMENSION: MILLIMETER.
3. DIMENSIONS A AND B DO NOT INCLUDE
MOLD PROTRUSION.
4. MAXIMUM MOLD PROTRUSION 0.15 (0.006)
PER SIDE.
5. DIMENSION D DOES NOT INCLUDE DAMBAR
PROTRUSION. ALLOWABLE DAMBAR
PROTRUSION SHALL BE 0.127 (0.005) TOTAL
IN EXCESS OF THE D DIMENSION AT
MAXIMUM MATERIAL CONDITION.
MILLIMETERS
INCHES
DIM MIN MAX MIN MAX
A 9.80 10.00 0.386 0.393
B 3.80 4.00 0.150 0.157
C 1.35 1.75 0.054 0.068
D 0.35 0.49 0.014 0.019
F 0.40 1.25 0.016 0.049
G
1.27 BSC
0.050 BSC
J 0.19 0.25 0.008 0.009
K 0.10 0.25 0.004 0.009
M 0_ 7_ 0_ 7_
P 5.80 6.20 0.229 0.244
R 0.25 0.50 0.010 0.019
18
1
–T–
SEATING
PLANE F
L SUFFIX
CERAMIC DIP PACKAGE
CASE 726–04
ISSUE G
–A–
10
–B–
9
OPTIONAL LEAD
CONFIGURATION (1, 9, 10, 18)
C
N
K
G
D 18 PL
0.25 (0.010) M T A S
L
M
J 18 PL
0.25 (0.010) M T B S
NOTES:
1. DIMENSIONING AND TOLERANCING PER
ANSI Y14.5M, 1982.
2. CONTROLLING DIMENSION: INCH.
3. DIMENSION L TO CENTER OF LEAD WHEN
FORMED PARALLEL.
4. DIMENSION F FOR FULL LEADS. HALF
LEADS OPTIONAL AT LEAD POSITIONS 1, 9,
10, AND 18.
INCHES
MILLIMETERS
DIM MIN MAX MIN MAX
A 0.880 0.910 22.35 23.11
B 0.240 0.295 6.10 7.49
C ––– 0.200 ––– 5.08
D 0.015 0.021 0.38 0.53
F 0.055 0.070 1.40 1.78
G 0.100 BSC
2.54 BSC
J 0.008 0.012 0.20 0.30
K 0.125 0.170 3.18 4.32
L 0.300 BSC
7.62 BSC
M
0_ 15_ 0_ 15_
N 0.020 0.040 0.51 1.02
MOTOROLA CMOS LOGIC DATA
MC14099B MC14599B
253
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