PC8245MTPU300D データシートの表示（PDF） - Atmel Corporation

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PC8245MTPU300D

Integrated Processor Family

Atmel Corporation 

Figure 3 shows the undershoot and overshoot voltage of the memory interface of the

PC8245.

Figure 3. Overshoot/Undershoot Voltage

4V

GVdd_OVvdd + 5%

VIH

GVdd_OVdd

GND/GNDRING

VIL

GND/GNDRING - 0.3V

GND/GNDRING Q - 1.0V

Not to exceed 10%

of tSDRAM_CLK

Thermal Characteristics Table 2 provides the package thermal characteristics for the PC8245. For further infor-

mation, see Section “Thermal Management Information” on page 15.

Table 2. Thermal Characterization Data

Symbol

Characteristic

Value

Unit

RθJA

Junction-to-ambient natural convection (Single-layer board—1s)(1)(2)

16.1

°C/W

RθJMA

Junction-to-ambient natural convection (Four-layer board—2s2p)(1)(3)

12.0

°C/W

RθJMA

Junction-to-ambient (at 200 ft/min) (Single-layer board—1s)(1)(3)

11.6

°C/W

RθJMA

Junction-to-ambient (at 200 ft/min)(Four layer board—2s2p)(1)(3)

9.0

°C/W

RθJB

Junction-to-Board(4)

4.8

°C/W

RθJC

Junction-to-Case(5)

1.8

°C/W

ΨJT

Junction-to-package top (natural convection)(6)

1.0

°C/W

Notes: 1. Junction temperature is a function of die size, on-chip power dissipation, package thermal resistance, mounting site (board)

temperature, ambient temperature, airflow, power dissipation of other components on the board, and board thermal

resistance.

2. Per SEMI G38-87 and JEDEC JESD51-2 with the single-layer board horizontal.

3. Per JEDEC JESD51-6 with the board horizontal.

4. Thermal resistance between the die and the printed-circuit board per JEDEC JESD51-8. Board temperature is measured on

the top surface of the board near the package.

5. Thermal resistance between the die and the case top surface as measured by the cold plate method (MIL SPEC-883

Method 1012.1) with the cold plate used for case temperature.

6. Thermal characterization parameter indicating the temperature difference between package top and the junction tempera-

ture per JEDEC JESD51-2. When Greek letters are not available, the thermal characterization parameter is written as Psi-

JT.

14 PC8245

2171D–HIREL–06/04

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