PC8245MTPU300D データシートの表示（PDF） - Atmel Corporation
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PC8245MTPU300D Datasheet PDF : 61 Pages
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Figure 5. Die Junction-to-Ambient Resistance
18
16
14
12
No heat sink and high thermal board-level loading of
adjacent components
No heat sink and low thermal board-level loading of
adjacent components
Attached heat sink and high thermal board-level loading of
adjacent components
Attached heat sink and low thermal board-level loading of
adjacent components
10
8
6
4
2
0
0.5
1
1.5
2
2.5
Airflow Velocity (m/s)
16 PC8245
2171D–HIREL–06/04
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