NXP Semiconductors
PMBT3906YS
40 V, 200 mA PNP/PNP general-purpose double transistor
6. Thermal characteristics
Table 7. Thermal characteristics
Symbol
Parameter
Per transistor
Rth(j-a)
thermal resistance from
junction to ambient
Rth(j-sp)
thermal resistance from
junction to solder point
Per device
Rth(j-a)
thermal resistance from
junction to ambient
Conditions
in free air
in free air
Min Typ Max Unit
[1] -
-
543 K/W
-
-
290 K/W
[1] -
-
357 K/W
[1] Device mounted on an FR4 PCB, single-sided copper, tin-plated and standard footprint.
103
Zth(j-a)
(K/W)
102
δ=1
0.75
0.5
0.33
0.2
0.1
0.05
0.02
10
0.01
0
006aab114
1
10−5
10−4
10−3
10−2
10−1
1
10
102
103
tp (s)
Fig 2.
FR4 PCB, standard footprint
Per transistor: Transient thermal impedance from junction to ambient as a function of pulse duration;
typical values
PMBT3906YS_2
Product data sheet
Rev. 02 — 13 May 2009
© NXP B.V. 2009. All rights reserved.
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