RBO40-40M データシートの表示（PDF） - STMicroelectronics
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RBO40-40M Datasheet PDF : 15 Pages
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RBO40-40G / RBO40-40M / RBO40-40T
SOLDERING RECOMMENDATION
The soldering process causes considerable
thermal stress to a semiconductor component.
This has to be minimized to assure a reliable and
extended lifetime of the device. The PowerSO-10
package can be exposed to a maximum
temperature of 260°C for 10 seconds. However a
proper soldering of the package could be done at
215°C for 3 seconds. Any solder temperature
profile should be within these limits. As reflow
techniques are most common in surface mounting,
typical heating profiles are given in Figure 1,either
for mounting on FR4 or on metal-backed boards.
For each particular board, the appropriate heat
profile has to be adjusted experimentally. The
present proposal is just a starting point. In any
case, the following precautions have to be
considered :
- always preheat the device
- peak temperatureshould be at least 30 °C
higher than the melting point of the solder
alloy chosen
- thermal capacity of the base substrate
Voids pose a difficult reliability problem for large
surface mount devices. Such voids under the
package result in poor thermal contact and the
high thermal resistance leads to component
failures. The PowerSO-10 is designed from
scratch to be solely a surface mount package,
hence symmetry in the x- and y-axis gives the
package excellent weight balance. Moreover, the
PowerSO-10offers the uniquepossibility to control
easily the flatness and quality of the soldering
process. Both the top and the bottom soldered
edges of the package are accessible for visual
inspection (soldering meniscus).
Coplanarity between the substrate and the
package can be easily verified. The quality of the
solder joints is very important for two reasons : (I)
poor quality solder joints result directly in poor
reliability and (II) solder thickness affects the
thermal resistance significantly. Thus a tight
control of this parameter results in thermally
efficient and reliable solder joints.
Fig. 1 : Typical reflow soldering heat profile
Temperature (o C)
250
245oC
200
215oC
150
Epoxy FR4
board
100
Soldering
Preheating
M et al -ba c k e d
50
board
Cooling
0
0 40 80 120 160 200 240 280 320 360
Time (s)
10/15
®
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