RP103 データシートの表示（PDF） - RICOH Co.,Ltd.
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RP103 Datasheet PDF : 20 Pages
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PACKAGE INFORMATION
POWER DISSIPATION (SOT-23-5)
This specification is at mounted on board. Power Dissipation (PD) depends on conditions of mounting
on board. This specification is based on the measurement at the condition below:
(Power Dissipation (SOT-23-5) is substitution of SOT-23-6.)
Measurement Conditions
Environment
Board Material
Board Dimensions
Copper Ratio
Through-holes
Standard Test Land Pattern
Mounting on Board (Wind velocity=0m/s)
Glass cloth epoxy plastic (Double sided)
40mm*40mm*1.6mm
Top side: Approx. 50%, Back side: Approx. 50%
φ 0.5mm * 44pcs
Measurement Result
Power Dissipation
Thermal Resistance
(Topt=25°C, Tjmax=125°C)
Standard Test Land Pattern
Free Air
420mW
250mW
θja = (125-25°C)/0.42W= 263°C/W
400°C/W
600
500
420
400
300 250
200
On Board
Free Air
100
0
0
25
50
75 85 100 125 150
Ambient Temperature (°C)
Power Dissipation
Measurement Board Pattern
IC Mount Area (Unit: mm)
Confidential
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