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RT9009 データシートの表示(PDF) - Richtek Technology

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RT9009 Datasheet PDF : 9 Pages
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RT9009
Note 1. Stresses listed as the above Absolute Maximum Ratingsmay cause permanent damage to the device. These are for
stress ratings. Functional operation of the device at these or any other conditions beyond those indicated in the operational
sections of the specifications is not implied. Exposure to absolute maximum rating conditions for extended periods may
remain possibility to affect device reliability.
Note 2. θJA is measured in the natural convection at TA = 25°C on a high effective four layers thermal conductivity test board of
JEDEC 51-7 thermal measurement standard. The case point of θJC is on the exposed pad for the package. The copper
area as heat sink is 225mm2.
Note 3. Devices are ESD sensitive. Handling precaution is recommended.
Note 4. The device is not guaranteed to function outside its operating conditions.
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DS9009-01 April 2011

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