RT9010 データシートの表示（PDF） - Richtek Technology
部品番号
コンポーネント説明
メーカー
RT9010 Datasheet PDF : 10 Pages
| |||
For recommended operating conditions specification of
RT9010, where TJ(MAX) is the maximum junction
temperature of the die (125°C) and TA is the operated
ambient temperature. The junction to ambient thermal
resistance (θJA is layout dependent) for TSOT-23-6 package
is 220°C/W on the standard JEDEC 51-3 single-layer
thermal test board. The maximum power dissipation at
TA = 25°C can be calculated by following formula :
PD(MAX) = ( 125°C - 25°C) / (220°C/W) = 0.455 W for
TSOT-23-6 packages
The maximum power dissipation depends on operating
ambient temperature for fixed TJ(MAX) and thermal
resistance θJA. For RT9010 packages, the Figure 3 of de-
rating curves allows the designer to see the effect of rising
ambient temperature on the maximum power allowed.
0.50
0.45
0.40
0.35
0.30
0.25
0.20
0.15
0.10
0.05
0.00
0
TSOT-23-6
25
50
75
100
125
Ambient Temperature (°C)
Figure 3. Derating Curves for RT9010 Packages
RT9010
DS9010-03 August 2007
www.richtek.com
9
Share Link: 