RT9011-MPPQW データシートの表示（PDF） - Richtek Technology

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RT9011-MPPQW

Portable Power Management 300mA Dual LDO Regulator

Richtek Technology 

RT9011

Preliminary

For recommended operating conditions specification of

RT9011, where TJ(MAX) is the maximum junction

temperature of the die (125°C) and TA is the operated

ambient temperature. The junction to ambient thermal

resistance (θJA is layout dependent) for TSOT-23-6 package

is 220°C/W and WDFN-8L 2x2 is 165°C/W on the standard

JEDEC 51-3 single-layer thermal test board. The maximum

power dissipation at TA = 25°C can be calculated by

following formula :

PD(MAX) = ( 125°C - 25°C ) / 220 = 0.455 W for TSOT-23-6

packages

PD(MAX) = ( 125°C - 25°C ) / 165 = 0.606 W for

WDFN-8L 2x2 packages

The maximum power dissipation depends on operating

ambient temperature for fixed TJ(MAX) and thermal

resistance θJA. For RT9011 packages, the Figure 3 of de-

rating curves allows the designer to see the effect of rising

ambient temperature on the maximum power allowed.

Power Dissipation vs. Ambient Temperature

0.8

0.7

0.6

WDFN-8L 2x2

0.5

0.4

0.3

TSOT-23-6

0.2

0.1

0

0

25

50

75

100

125

Ambient Temperature (°C)

Figure 3. Derating Curves for RT9011 Packages

www.richtek.com

10

DS9011-05 August 2007

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