SAA7240 データシートの表示（PDF） - Philips Electronics

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SAA7240

MPEG-2 Transport RISC processor

Philips Electronics 

Philips Semiconductors

MPEG-2 Transport RISC processor

Product specification

SAA7240

6 LIMITING VALUES

In accordance with the Absolute Maximum Rating System (IEC 60134).

SYMBOL

PARAMETER

MIN. MAX. UNIT

VDDP

supply voltage for the I/O buffers

−0.5 4.0

V

VDDC, VDDA supply voltages for the core, PLL and oscillator

−0.5 3.0

V

VI

input voltage on any pin with respect to ground (VSS)

−0.5 VDD + 0.5 V

Ptot

total power dissipation (based on package transfer, not IC power consumption) − Ptot(max)(1) W

IDDC

core supply current

−

500(2)

mA

IDDP

supply current for the I/O buffers

−

330(3)

mA

Tstg

storage temperature

−55 150

°C

Tamb

ambient temperature

0 70

°C

Tj

junction temperature

− 125

°C

Notes

1. System designers should be aware that:

a) The IC junction temperature (Tj) is greatly influenced by the environment and the Printed-Circuit Board (PCB)

layout thermal behaviour. Total allowable power Ptot in the customer application depends on its thermal

characteristics; thermal resistance from junction to air; (Rth(j-a), refer to Chapter 8) and ambient temperature Tamb.

Ptot(max) = (Tj(max) − Tamb)/Rth(j-a) = PINT + PI/O. PINT represents the internal device power (core and PLL). PI/O is

the power dissipation in the input and output buffers. PINT depends on the user application and is limited by the

maximum drive capability of the output buffers.

b) Table 3 gives some examples of theoretical maximum power dissipation supported by the package; the designer

has to check that there is no IDDP maximum current violation.

2. This value represents the maximum current that the power track can carry without excessive voltage drop in the

internal chip. This value does not reflect the maximum current consumption of the core, which is far below this value.

3. This theoretical maximum value which should never be exceeded is determined when all output buffers are driving

their specified maximum static drive current. In a standard application, this worst case never occurs because the

output loads are mainly line capacitance and not resistive loads.

7 HANDLING

Inputs and outputs are protected against electrostatic discharges in normal handling. However, to be totally safe, it is

desirable to take normal precautions appropriate to handling CMOS integrated circuits.

8 THERMAL CHARACTERISTICS

SYMBOL

PARAMETER

Rth(j-a)

thermal resistance from junction to ambient

CONDITIONS

in free air

VALUE

35(1)

UNIT

°C/W

Note

1. When the device is soldered onto a PCB, the intrinsic thermal resistance of the package is improved. The Rth(j-a)

value depends on the PCB type; some typical values are given below:

a) For a standard PCB; Rth(j-a) = 32 °C/W.

b) For a 4-layer PCB; Rth(j-a) = 28 °C/W.

c) For a 4-layer PCB with thermal dissipation layer; Rth(j-a) = 24 °C/W.

2001 Oct 22

19

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