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SC1564 データシートの表示(PDF) - Semtech Corporation

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SC1564 Datasheet PDF : 11 Pages
1 2 3 4 5 6 7 8 9 10
SC1564
Applications Information
Introduction
Thermal Considerations
The SC1564 is intended for applications such as graph-
ics cards where high current capability and low drop-
out voltage are required. It provides a very simple, low
cost solution that uses little PCB real estate. Additional
features include a shutdown pin to allow for a very low
power consumption standby mode, and a fully adjust-
able output.
Component Selection
Input capacitor: A 1µF ceramic capacitor is recommended.
This allows for the device some distance from any bulk
capacitance on the rail. Additionally, input droop due
to load transients is reduced, improving load transient
response. Additional capacitance may be added if
required by the application.
Output capacitor: A minimum bulk capacitance of 1µF,
along with a 0.1µF ceramic decoupling capacitor, is rec-
ommended. Increasing the bulk capacitance will improve
the overall transient response. The use of multiple lower
value ceramic capacitors in parallel to achieve the desired
bulk capacitance will not cause stability issues. Although
designed for use with ceramic output capacitors, the
SC1564 is extremely tolerant of output capacitor ESR
values and thus will also work comfortably with tantalum
output capacitors.
Noise immunity: In very electrically noisy environents, it
is recommended that 0.1µF ceramic capacitors be placed
from IN to GND and OUT to GND as close to the device
pins as possible.
The power dissipation in the SC1564 is approximately
equal to the product of the output current and the input
to output voltage differential:
PO (VIN  VOUT ) ˜ IOUT
The absolute worst-case dissipation is given by:
PO(MAX) = ( VIN(MAX) V ) I OUT(MIN) OUT(MAX) + VIN(MAX) IQ(MAX)
For a typical scenario, VIN = 3.3V ± 5%, VOUT = 1.5V and
IOUT = 600mA, therefore:
VIN(MAX) = 3.465V,
VOUT(MIN) = 1.47V and
IQ(MAX) = 170µA,
Thus PD(MAX) = 1.1976W.
Using this figure, and assuming TA(MAX) = 85°C, we can
calculate the maximum thermal impedance allowable
to maintain TJ 150°C:
R TH(JA)(MAX)
¨¨©§
T  T J(MAX)
A(MAX)
PO(MAX)
¸¸¹·
¨©§
150qC  85qC
1.1976W
¸¹·
54.3qC W
This should be achievable with the 3mm x 3mm MLPD-8
package using PCB copper area to aid in conducting the
heat away from the device. Internal ground/power planes
and air flow will also assist in removing heat.
External voltage selection resistors: the use of 1% resis-
tors, designed for a current flow 10µA is recommended
to ensure a well-regulated output (tus, R2 120k).


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