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SC1566(2001) データシートの表示(PDF) - Semtech Corporation

部品番号
コンポーネント説明
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SC1566
(Rev.:2001)
Semtech
Semtech Corporation Semtech
SC1566 Datasheet PDF : 9 Pages
1 2 3 4 5 6 7 8 9
POWER MANAGEMENT
Applications Information (Cont.)
( ) ( ) R = TH(JA )(MAX )
TJ(MAX ) TA (MAX )
PD(MAX )
= 150 85
1.81
= 36°C / W
R TH(JC)(MAX ) = 3°C / W and R TH(CS) = 0°C / W,
therefore R TH(SA )(MAX ) = 33°C / W
Outline Drawing - T0-263-3
SC1566
This should be achievable for the TO-263 package using
pcb copper area to aid in conducting the heat away from
the device, such as a large (~2 squ. inch) pad connected
to the tab of the device. Internal ground/power planes
and air flow will also assist in removing heat. For higher
power dissipations it may be necessary to use a small
heatsink and the TO-220 package.
Minimum Land Pattern - TO-263-3
ã 2001 Semtech Corp.
7
www.semtech.com

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