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SC4212 データシートの表示(PDF) - Semtech Corporation

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SC4212 Datasheet PDF : 9 Pages
1 2 3 4 5 6 7 8 9
SC4212
Applications Information
Introduction
The SC4212 is intended for applications where high
current capability and very low dropout voltage are
required. It provides a very simple, low cost solution
that uses very little PCB real estate. Additional features
include an enable pin to allow for a very low power con-
sumption standby mode, and a fully adjustable output.
Component Selection
where an input voltage of < 1.9V is required. For applica-
tions with input voltages higher than 1.9V, the EN pin
could be left open or connected to VIN.
Thermal Considerations
The power dissipation in the SC4212 is approximately
equal to the product of the output current and the
input to output voltage differential:
Input capacitor: A large bulk capacitance of ≥ 10μF
should be placed close to the input supply pin of the
SC4212 to ensure that VIN does not sag below 1.5V. Also
a minimum 4.7μF ceramic capacitor is recommended
to be placed directly next to the VIN pin. This allows
for the device being some distance fromany bulk ca-
pacitance on the rail. Additionally, input droop due to
load transients is reduced, improving load transient
response. Additional capacitance may be added if re-
quired by the application.
Output capacitor: A minimum bulk capacitance of ≥
10μF, along with a 0.1μF ceramic decoupling capacitor
is recommended. Increasing the bulk capacitance will
improve the overall transient response.The use of mul-
tiple lower value ceramic capacitors in parallel to achieve
the desired bulk capacitance will not cause stability
issues. Although designed for use with ceramic output
capacitors, the SC4212 is extremely tolerant of output
capacitor ESR values and thus will also work comfortably
with tantalum output capacitors.
Noise immunity: In very electrically noisy environments,
it is recommended that 0.1 μF ceramic capacitors be
placed from VIN to GND and VOUT to GND as close to the
device pins as possible.
P = (V - V ) x I
O
IN OUT OUT
The absolute worst-case dissipation is given by:
P =V -V )xI
+V xI
O(MAX) IN(MAX) OUT(MIN) OUT(MAX) IN(MAX) Qt(MAX)
For a typical scenario, VIN = 3.3V ± 5%, VOUT = 2.8V and
IOUT = 1A, therefore:
VIN(MAX) = 3.465V,
VOUT = 2.744V and
(MIN)
I = 3mA
Q(MAX)
Thus P = 0.731W.
D(MAX)
Using this figure, and assuming T = 70°C, we can
A(MAX)
calculate the maximum thermal impedance allowable
to
maintain
T
J
125°C:
R TH(J A)(MAX)
=
¨¨©§
T T J(MAX) A(MAX)
PO(MAX)
¸¸¹·
=
¨§125°C 85°C
© 0.722W
¸·
¹
=
76 °C
W
This should be achievable with the 3mm x 3mm MLPD-8
package using PCB copper area to aid in conducting the
heat away, such as one square inch of copper connected
to the ground pins of the device. Internal ground/power
planes and air flow will also assist in removing heat. For
higher ambient tempertures it may be necessary to use
additional copper area.
External voltage selection resistors: The use of 1%
resistors is recommended.
Enable: Pulling the EN pin below 0.5V turns the regula-
tor off, reducing the quiescent current to a fraction of its
operating value. A pull up resistor up to 400kΩ should be
connected from the EN pin to the VIN pin in application
7

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