Q65110A2466 データシートの表示（PDF） - OSRAM GmbH
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Q65110A2466 Datasheet PDF : 13 Pages
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Version 1.5
SFH 4257
Reflow Soldering Profile
Product complies to MSL Level 2 acc. to JEDEC J-STD-020E
300
˚C
T 250
240 ˚C
217 ˚C
tP
200
tL
150
tS
100
OHA04525
Tp 245 ˚C
50
25 ˚C
0
0
50
100
150
200
250
s 300
t
Profile Feature
Profil-Charakteristik
Ramp-up rate to preheat*)
25 °C to 150 °C
Symbol
Symbol
Pb-Free (SnAgCu) Assembly
Minimum Recommendation Maximum
2
3
Time tS
TSmin to TSmax
tS
60
Ramp-up rate to peak*)
TSmax to TP
Liquidus temperature
TL
Time above liquidus temperature
tL
100
120
2
3
217
80
100
Peak temperature
TP
245
260
Time within 5 °C of the specified peak tP
10
20
30
temperature TP - 5 K
Ramp-down rate*
TP to 100 °C
Time
25 °C to TP
3
6
480
All temperatures refer to the center of the package, measured on the top of the component
* slope calculation DT/Dt: Dt max. 5 s; fulfillment for the whole T-range
OHA04612
Unit
Einheit
K/s
s
K/s
°C
s
°C
s
K/s
s
2017-02-17
7
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