SGM8091 データシートの表示（PDF） - Shengbang Microelectronics Co, Ltd
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SGM8091 Datasheet PDF : 17 Pages
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PACKAGE/ORDERING INFORMATION
MODEL
SGM8091
SGM8092
SGM8093
SGM8094
ORDER NUMBER
SGM8091XN5/TR
SGM8091XS/TR
SGM8092XS/TR
SGM8092XMS/TR
SGM8093XN6/TR
SGM8093XS/TR
SGM8094XS/TR
SGM8094XTS
PACKAGE
DESCRIPTION
SOT23-5
SO-8
SO-8
MSOP-8
SOT23-6
SO-8
SO-16
TSSOP-16
PACKAGE
OPTION
Tape and Reel, 3000
Tape and Reel, 2500
Tape and Reel, 2500
Tape and Reel, 3000
Tape and Reel, 3000
Tape and Reel, 2500
Tape and Reel,2500
Tape and Reel, 3000
MARKING
INFORMATION
8091
SGM8091XS
SGM8092XS
SGM8092XMS
8093
SGM8093XS
SGM8094XS
SGM8094XTS
ABSOLUTE MAXIMUM RATINGS
Supply Voltage, V+ to V- ......................................... 7.5 V
Common-Mode Input Voltage
..................................... (–VS )– 0.5 V to (+VS) +0.5V
Storage Temperature Range ................ –65℃ to +150℃
Junction
Temperature ............................................................. 160℃
Operating Temperature Range ........... –55℃ to +150℃
Package Thermal Resistance @ TA = 25℃
SOT23-5, θJA......................................................... 190℃/W
SOT23-6, θJA.......................................................... 190℃/W
SO-8, θJA..................................................................125℃/W
MSOP-8, θJA.......................................................... 216℃/W
SO-16, θJA................................................................ 82℃/W
TSSOP-16, θJA....................................................... 105℃/W
Lead Temperature Range (Soldering 10 sec)
................................................ 260℃
ESD Susceptibility
HBM...........................................................................1000V
MM...............................................................................400V
CAUTION
This integrated circuit can be damaged by ESD.
Shengbang Micro-electronics recommends that all
integrated circuits be handled with appropriate
precautions. Failure to observe proper handling and
installation procedures can cause damage.
ESD damage can range from subtle performance
degradation to complete device failure. Precision
integrated circuits may be more susceptible to
damage because very small parametric changes
could cause the device not to meet its published
specifications.
NOTES
1. Stresses above those listed under Absolute Maximum
Ratings may cause permanent damage to the device. This is
a stress rating only; functional operation of the device at
these or any other conditions above those indicated in the
operational section of this specification is not implied.
Exposure to absolute maximum rating conditions for
extended periods may affect device reliability.
３
SGM8091/2/3/4
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