SIP12202DB データシートの表示（PDF） - Vishay Semiconductors
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SIP12202DB Datasheet PDF : 10 Pages
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SiP12202
Vishay Semiconductors
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noise levels can be minimized by properly laying out the
components. Here are some general guidelines for lay-
ing out a step-down converter with the SiP12202. Since
power traces in step down converters carry pulsating
current, energy stored in trace inductance during the
pulse can cause high-frequency ringing with input and
output capacitors. Minimizing the length of the power
traces will minimize the parasitic inductance in the trace.
The same pulsating currents can cause voltage drops
due to the trace resistance and cause effects such as
ground bounce. Increasing the width of the power trace,
which in-creases the cross sectional area, will minimize
the trace resistance. In all dc-to-dc converters the de-
coupling capacitors should be placed as close as possi-
ble to the pins being decoupled to reduce the noise. The
connections to both terminals should be as short as pos-
sible with low-inductance (wide) traces. In the SiP12202
converters, the VIN is decoupled to PGND. It may be
necessary to decouple VDD to AGND, with the decoup-
ling capacitor being placed adjacent to the pins. AGND
and PGND traces should be isolated from each other
and only connected at a single node such as a "star
ground".
www.vishay.com
10
Document Number: 73542
S-52083–Rev. A, 10-Oct-05
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