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SM802111 データシートの表示(PDF) - Micrel

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SM802111 Datasheet PDF : 7 Pages
1 2 3 4 5 6 7
Micrel, Inc.
SM802111
Absolute Maximum Ratings(1)
Supply Voltage (VDD, VDDO) .........................................+4.6V
Input Voltage (VIN) .............................. 0.50V to VDD + 0.5V
Lead Temperature (soldering, 20s)............................ 260°C
Case Temperature ..................................................... 115°C
Storage Temperature (Ts) ......................... 65°C to +150°C
Operating Ratings(2)
Supply Voltage (VDD, VDDO) .................. +2.375V to +3.465V
Ambient Temperature (TA) .......................... –40°C to +85°C
Junction Thermal Resistance(3)
QFN (θJA)
Still-Air ......................................................... 50°C/W
QFN (ψJB)
Junction-to-Board ........................................ 30°C/W
DC Electrical Characteristics(4)
VDD = VDDO = 3.3V ±5% or 2.5V ±5%
VDD = 3.3V ±5%, VDDO = 3.3V ±5% or 2.5V ±5%
TA = –40°C to +85°C
Symbol Parameter
Condition
VDD, VDDO
VDD, VDDO
IDD
2.5V Operating Voltage
3.3V Operating Voltage
Supply Current, VDD + VDDO
Outputs open
Min.
2.375
3.135
Typ.
2.5
3.3
91
Max.
2.625
3.465
115
Units
V
V
mA
LVPECL DC Electrical Characteristics(4)
VDD = VDDO 3.3V ±5% or 2.5V ±5%
VDD = 3.3V ±5%, VDDO = 3.3V ±5% or 2.5V ±5%
TA = –40°C to +85°C; RL = 50to VDDO 2V
Symbol Parameter
Condition
VOH
VOL
VSWING
Output High Voltage
Output Low Voltage
Output Voltage Swing
Min.
VDDO – 1.145
VDDO – 1.945
0.6
Typ.
VDDO – 0.97
VDDO – 1.77
0.8
Max.
VDDO – 0.845
VDDO – 1.645
1.0
Units
V
V
V
LVCMOS (PLL_BYPASS) DC Electrical Characteristics(4)
VDD = 3.3V ±5% or 2.5V ±5%, TA = –40°C to +85°C
Symbol Parameter
Condition
VIH
Input High Voltage
VIL
Input Low Voltage
Min.
2
0.3
Typ.
Max.
VDD + 0.3
0.8
Units
V
V
IIH
Input High Current
VDD = VIN = 3.465V
150
μA
IIL
Input Low Current
VDD = 3.465V, VIN = 0V
5
μA
Notes:
1. Permanent device damage may occur if absolute maximum ratings are exceeded. This is a stress rating only and functional operation is not
implied at conditions other than those detailed in the operational sections of this data sheet. Exposure to absolute maximum rating conditions for
extended periods may affect device reliability.
2. The data sheet limits are not guaranteed if the device is operated beyond the operating ratings.
3. Package thermal resistance assumes exposed pad is soldered (or equivalent) to the devices most negative potential on the PCB.
4. The circuit is designed to meet the AC and DC specifications shown in the above table after thermal equilibrium has been established.
April 2011
3
M9999-041111-A
hbwhelp@micrel.com or (408) 955-1690

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