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NE590N データシートの表示(PDF) - Philips Electronics

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NE590N
Philips
Philips Electronics Philips
NE590N Datasheet PDF : 9 Pages
1 2 3 4 5 6 7 8 9
Philips Semiconductors Linear Products
Addressable peripheral drivers
Product specification
NE590/591
SWITCHING CHARACTERISTICS
VCC = 5V, TA = 25°C
SYMBOL
PARAMETER
TO
FROM
NE590
Min Typ Max
Propagation delay time
tPLH
Low-to-High1
tPHL
High-to-Low1
tPLH
Low-to-High2
tPHL
High-to-Low2
tPLH
Low-to-High3
tPHL
High-to-Low3
tPLH
Low-to-High4
tPHL
High-to-Low4
tPLH
Low-to-High1
tPHL
High-to-Low1
Switching setup requirements
Output
Output
Output
Output
Output
CE
Data
Address
CLR
CS
65 150
115 230
65 130
120 240
100 200
130 260
65 130
tS(H)
Chip enable
High data
210
tS(L)
Chip enable
Low data
210
tS(A)
Chip enable
Address
30
tH(H)
Chip enable
High data
40
tH(L)
Chip enable
Low data
30
tS(CS)
Chip enable Low chip select
tPW(E)
Chip enable pulse width1
120
NOTES:
1. See Turn-On and Turn-Off Delays, Enable to Output and Enable Pulse Width timing diagram.
2. See Turn-On and Turn-Off Delays, Data to Output timing diagram.
3. See Turn-On and Turn-Off Delays, Address to Output timing diagram.
4. See Turn-Off Delay, Clear to Output timing diagram.
5. See Setup and Hold Time, Data to Enable timing diagram.
6. See Setup Time, Address to Enable timing diagram.
NE591
Min Typ Max
50 80
70 120
45 70
65 100
45 80
75 140
45 140
40 80
70 120
100
100
30
10
10
100
120
UNIT
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
FUNCTIONAL DESCRIPTION
These peripheral drivers have latched outputs which hold the input
data until cleared. The NE590 has active-Low, open-collector
outputs, while the NE591 has active-High, uncommitted (open)
emitter outputs. All outputs are cleared when power is first applied.
Addressable Latch Function
Any given output can be turned on or off by presenting the address
of the output to be set or cleared to the three address pins, by
holding the “D” input High to turn on the selected input, or by holding
it Low to turn off, holding the CLR input High, and bringing the CE
input Low. Once an output is turned on or off, it will remain so until
addressed again, or until all outputs are cleared by bringing the
CLR, CE, and “D” inputs Low. For NE591, CS must be brought Low
any time CE is Low if any outputs are to be changed.
Demultiplexer Operation
By bringing the CLR and CE inputs Low and the “D” input High, the
addressed output will remain on and all other outputs will be off. This
condition will remain only as long as the output is addressed. For the
NE591, the CS input must also be Low.
High Current Outputs
The obvious advantage of these devices over the 9334 and
N74LS259 (which provide a similar function) is the fact that the
NE590 and NE591 are capable of output currents of 250mA at each
of their eight outputs. It should be noted, however, that the load
power dissipation would be over 2.5W if all 8 outputs were to carry
their full rated load current at one time. Since the total power
dissipation is limited by the package to 1W, and since the power
dissipation due to supply current is 0.25W, the total load power
dissipation by the device is limited to 0.75W, and decreases as
ambient temperature rises.
The maximum die junction temperature must be limited to 165°C,
and the temperature rise above ambient and the junction
temperature are defined as:
tR=θJA×P
tJ=tA+tR
where
θJA is die junction to ambient thermal resistance.
PD is total power dissipation
tR is junction temperature rise above ambient
tj is die junction temperature
tA is ambient (surrounding medium) temperature
For example, if we are using the NE590 in a plastic package in an
application where the ambient temperature is never expected to rise
above 50°C, and the output current at the 8 outputs, when on, are
100, 40, 50, 200, 15, 30, 80, and 10mA, we find from the graph of
output voltage vs load current that the output voltages are expected
to be about 0.92, 0.75, 0.78, 1.04, 0.5, 0.7, 0.9, and 0.4V,
respectively. Total device power due to these loads is found to be
473.5mW. Adding the 250mW due to the power supply brings total
device power dissipation to 723.5mW. The thermal resistances are
83°C per W for plastic packages and 100°C per W for Cerdips.
Using the equations above we find:
August 31, 1994
523

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