8784 データシートの表示（PDF） - TriQuint Semiconductor

部品番号

コンポーネント説明

メーカー

8784

Analog attenuator

TriQuint Semiconductor 

MECHANICAL DRAWING

1,2192

(0.0480)

TGL8784-SCC

0,5563

1

(0.0219)

2

0,5563

(0.0219)

0,1296

(0.0051)

0.0

0.0 0,1372

(0.0054)

3

4

5

0,7595 0,8611 1,0871

(0.0299)(0.0339)(0.0428)

1,5646 1,7018

(0.0616) (0.0670)

Units: millimeters (inches)

Thickness: 0,1524 (0.006) (reference only)

Chip edge to bond pad dimensions are shown to center of bond pad.

Chip size ±0,0508 (0.002)

Bond pad #1 (RF Input):

Bond pad #2 (RF Output):

Bond pad #3 (+VC , Attenuation Control):

Bond pad #4 (0V):

Bond pad #5 (+VCC):

0,0960 x 0,2000 (0.0038 x 0.0079)

0,0960 x 0,2000 (0.0038 x 0.0079)

0,0960 x 0,0960 (0.0038 x 0.0038)

0,0960 x 0,0960 (0.0038 x 0.0038)

0,0960 x 0,0960 (0.0038 x 0.0038)

9

TriQuint Semiconductor, Inc. • Texas Facilities • (972) 995-8465 • www.triquint.com

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