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HI-8382 データシートの表示(PDF) - Holt Integrated Circuits

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HI-8382
Holt
Holt Integrated Circuits Holt
HI-8382 Datasheet PDF : 8 Pages
1 2 3 4 5 6 7 8
HI-8382, HI-8383
HI-8382 PACKAGE THERMAL CHARACTERISTICS
PACKAGE STYLE 1
28 Lead PLCC
16 Lead Ceramic SB DIP
M AXIM U M ARINC LOAD 7
ARINC 429
DATA RATE
SUPPLY CURRENT (mA) 2
Ta = 25oC Ta = 85oC Ta=125oC
Low Speed 3
17.6
17.2
17.0
High Speed 4
25.4
24.5
24.2
Low Speed
17.9
17.4
17.1
High Speed
25.8
24.8
24.4
JUNCTION TEMP, Tj (°C)
Ta = 25oC Ta = 85oC Ta=125oC
48
107
142
56
110
150
41
103
145
47
112
147
PACKAGE STYLE 1
28 Lead PLCC
AOUT and BOUT Shorted to Ground 5, 6, 7
ARINC 429
SUPPLY CURRENT (mA) 2
JUNCTION TEMP, Tj (°C)
DATA RATE Ta = 25oC Ta = 85oC Ta=125oC Ta = 25oC Ta = 85oC Ta=125oC
Low Speed 3
60.1
55.7
52.4
110
157
194
High Speed 4
63.1
56.3
52.3
100
150
182
Low Speed
62.1
56.2
53.0
90
145
180
16 Lead Ceramic SB DIP
High Speed
64.0
56.2
52.2
86
144
176
Notes:
1. All data taken in still air on devices soldered to a single layer copper PCB (3" X 4.5" X .062").
2. At 100% duty cycle, 15V power supplies. For 12V power supplies multiply all tabulated values by 0.8.
3. Low Speed: Data Rate = 12.5 Kbps, Load: R = 400 Ohms, C = 30 nF.
4. High Speed: Data Rate = 100 Kbps, Load: R = 400 Ohms, C = 10 nF. Data not presented for C = 30
as this is considered unrealistic for high speed operation.
5. Similar results would be obtained with AOUT shorted to BOUT.
6. For applications requiring survival with continuous short circuit, operation above Tj = 175°C is not recommended.
7. Data will vary depending on air flow and the method of heat sinking employed.
HI-8383 part numbers identical except the SMD version is not available.
NUMBER
DESCRIPTION
HI-8382C
16 PIN CERAMIC SIDE BRAZED DIP
HI-8382CT 16 PIN CERAMIC SIDE BRAZED DIP
HI-8382CM-01 16 PIN CERAMIC SIDE BRAZED DIP
HI-8382CM-03* 16 PIN CERAMIC SIDE BRAZED DIP
HI-8382J
28 PIN PLASTIC J -LEAD PLCC
HI-8382JT
28 PIN PLASTIC J -LEAD PLCC
HI-8382S
28 PIN CERAMIC LEADLESS CHIP CARRIER
HI-8382ST 28 PIN CERAMIC LEADLESS CHIP CARRIER
HI-8382SM-01 28 PIN CERAMIC LEADLESS CHIP CARRIER
HI-8382U
32 PIN J-LEAD CERQUAD
HI-8382UT 32 PIN J-LEAD CERQUAD
RANGE
FLOW IN FINISH
-40°C TO +85°C
I
NO GOLD
-55°C TO +125°C T NO GOLD
-55°C TO +125°C M YES SOLDER
-55°C TO +125°C DSCC YES SOLDER
-40°C TO +85°C
I
NO SOLDER
-55°C TO +125°C T NO SOLDER
-40°C TO +85°C
I
NO GOLD
-55°C TO +125°C T NO GOLD
-55°C TO +125°C M YES SOLDER
-40°C TO +85°C
I
NO SOLDER
-55°C TO +125°C T NO SOLDER
HOLT INTEGRATED CIRCUITS
5

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