Preliminary
SNC759
16-bit Voice Processor
============ CONTENTS ============
1. INTRODUCTION ..............................................................................................................................3
2. FEATURES.........................................................................................................................................3
3. PIN ASSIGNMENT ...........................................................................................................................4
4. ROM TABLE......................................................................................................................................6
5. RAM TABLE ......................................................................................................................................7
6. SYSTEM CLOCK ..............................................................................................................................8
6.1 CRYSTAL INPUT .................................................................................................................................8
6.2 ROSC INPUT ......................................................................................................................................8
7. I/O PORT ............................................................................................................................................9
8. TIMER/COUNTER .........................................................................................................................10
9. PUSH-PULL DAC............................................................................................................................11
10. REGULATOR ................................................................................................................................11
11. ABSOLUTE MAXIMUM RATINGS...........................................................................................12
12. ELECTRICAL CHARACTERISTICS ........................................................................................12
13. APPLICATION CIRCUIT............................................................................................................13
14. BONDING PAD..............................................................................................................................15
Ver. 1.5
1
March 7, 2007