SP3002 データシートの表示（PDF） - Littelfuse, Inc

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SP3002

TVS Diode Arrays (SPA ™Family of Products) - Low Capacitance ESD Protection

Littelfuse, Inc 

TVS Diode Arrays (SPA™Family of Products)

Low Capacitance ESD Protection - SP3002 Series

Capacitance vs. Frequency

2E-12

1.8E-12

1.6E-12

1.4E-12

1.2E-12

1E-12

8E-13

6E-13

4E-13

2E-13

0

1.E+06

1.E+07

1.E+08

Frequency [Hz]

1.E+09

Soldering Parameters

Reflow Condition

Pb – Free assembly

- Temperature Min (Ts(min))

Pre Heat - Temperature Max (Ts(max))

- Time (min to max) (ts)

Average ramp up rate (Liquidus) Temp

(T ) to peak

L

T toT - Ramp-up Rate

S(max)

L

Reflow

-Temperature (T ) (Liquidus)

L

-Temperature (t )

L

PeakTemperature (T )

P

Time within 5°C of actual peak

Temperature (tp)

Ramp-down Rate

Time 25°C to peak Temperature (TP)

Do not exceed

150°C

200°C

60 – 180 secs

3°C/second max

3°C/second max

217°C

60 – 150 seconds

250+0/-5 °C

20 – 40 seconds

6°C/second max

8 minutes Max.

260°C

Product Characteristics

Lead Plating

Lead Material

SC70 & SOT23: Matte Tin

uDFN: Pre-Plated Frame

Copper Alloy

Lead Coplanarity

0.0004 inches (0.102mm)

Subsitute Material

Silicon

Body Material

Molded Epoxy

Flammability

UL94-V-0

Notes :

1. All dimensions are in millimeters

2. Dimensions include solder plating.

3. Dimensions are exclusive of mold flash & metal burr.

4. All specifications comply to JEDEC SPEC MO-223 Issue A

5. Blo is facing up for mold and facing down for trim/form, i.e. reverse trim/form.

6. Package surface matte finish VDI 11-13.

TP

TL

TS(max)

TS(min)

Ramp-up

Preheat

tS

25

time to peak temperature

tP

Critical Zone

TL to TP

tL

Ramp-down

Time

©2011 Littelfuse, Inc.

Specifications are subject to change without notice.

Please refer to www.littelfuse.com/SPA for current information.

91

Revision: April 14, 2011

SP3002 Series

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