SP4427TR データシートの表示（PDF） - Signal Processing Technologies

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SP4427TR

Electroluminescent Lamp Driver Dual Oscillators with High Drive Capability

Signal Processing Technologies 

ABSOLUTE MAXIMUM RATINGS

These are stress ratings only and functional operation of the device at

these ratings or any other above those indicated in the operation sections

of the specifications below is not implied. Exposure to absolute maximum

rating conditions for extended periods of time may affect reliability.

Vdd............................................................................................................7.0V

Input Voltages/Currents

HON (pin1)..........................................-0.5V to (Vdd+0.5V)

COIL (pin3)............................................................100mA

Lamp Outputs.............................................................................250Vpp

Storage Temperature....................................................-65˚C to +150˚C

Power Dissipation.......................................................................200mW

SPECIFICATIONS

(T= 25°C; Vdd = 1.5V; Lamp Capacitance = 8000pF; Coil = 20 mH at 70 Ohms; Coil OSC = 220pF, Lamp OSC = 1800pF unless otherwise noted)

PARAMETER

MIN. TYP. MAX. UNIT CONDITIONS

INPUT CHARACTERISTICS

Supply Voltage

Total Supply Current

Quiescent Supply Current

1.5

Volts

10

15 mA Vdd= 1.5V ±5%; Hon= 1.5V

100 200 nA Vdd= 1.5V ±5%; Hon= 0.2V

Hon Voltage On

Hon Current On

Hon Voltage Off

1.1 Vdd

Volts

10 µA Internal pulldown

<Vdd/2 Volts

INDUCTOR DRIVE

Peak Current

Pulse Rate

Duty Cycle

60

mA

3

5

6

kHz

70

75

85 %

LAMP OUTPUT

Differential Voltage

Frequency

Lamp Capacitance

80

110

Vpp

150 250 350 Hz

8000

pF

Bonding Diagram:

ELEN

CAP 1

CAP 2

664A

SP4427

VSS

VDD

EL 1

EL 2

COIL

PAD

EL1

EL2

COIL

VSS

HON

CAP2

CAP1

VDD

X

586.0

586.0

586.0

80.0

562.5

565.0

562.5

588.0

Y

107.0

-143.0

-376.0

-417.0

-397.0

-118.0

114.5

417.0

NOTES:

1. Dimensions are in Microns unless otherwise noted.

2. Bonding pads are 125x125 typ.

3. Outside dimensions are maximum, including scribe area.

4. Die thickness is 380 +/- 25 microns (15 mils +/- 1).

5. Pad center coordinates are relative to die center.

6. Die size 1498 x 1168 ( 59 x 46 mils).

SP4427DS/01

SP4427 Electroluminescent Lamp Driver

2

© Copyright 1997 Sipex Corporation

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