SP4428CN データシートの表示（PDF） - Signal Processing Technologies

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SP4428CN

Electroluminescent Lamp Driver High Drive Capability for Low Voltage Applications

Signal Processing Technologies 

BONDING DIAGRAM

HON

VDD EL1

X

Y

COSC

EL2

CAP

VSS COIL

PAD PIN X

HON 8 -822.5

VDD

7

205.0

EL1 6 796.0

EL2 5 870.5

CAP 4 870.5

COIL 3 785.5

VSS

2

175.5

COSC

1 -848.0

Y

393.5

418.5

349.5

19.5

-189.5

-389.5

-420.5

-106.0

NOTES:

1. Dimensions are in Microns unless otherwise noted.

2. Bonding pads are 125 X 125 typical.

3. Outside dimensions are maximum, including scribe area.

4. Die thickness is 380 ± 25 microns.

5. Pad center coordinates are relative to die center.

6. Die size (step size): 81 X 46 mils

Figure 5. Bonding Diagram

SP4428DS/16

SP4428 Electroluminescent Lamp Driver

8

© Copyright 2000 Sipex Corporation

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