SST32HF802-70-4C-L3K データシートの表示（PDF） - Silicon Storage Technology
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SST32HF802-70-4C-L3K Datasheet PDF : 30 Pages
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Multi-Purpose Flash (MPF) + SRAM ComboMemory
SST32HF202 / SST32HF402 / SST32HF802
Data Sheet
TABLE 4: SOFTWARE COMMAND SEQUENCE
Command
Sequence
1st Bus
Write Cycle
Addr1 Data
Word-Program
5555H AAH
Sector-Erase
5555H AAH
Block-Erase
5555H AAH
Chip-Erase
5555H AAH
Software ID Entry4,5 5555H AAH
Software ID Exit
XXH F0H
Software ID Exit
5555H AAH
2nd Bus
Write Cycle
Addr1 Data
2AAAH 55H
2AAAH 55H
2AAAH 55H
2AAAH 55H
2AAAH 55H
2AAAH 55H
3rd Bus
Write Cycle
Addr1 Data
5555H A0H
5555H 80H
5555H 80H
5555H 80H
5555H 90H
5555H F0H
4th Bus
Write Cycle
Addr1 Data
WA2 Data
5555H AAH
5555H AAH
5555H AAH
5th Bus
Write Cycle
Addr1 Data
2AAAH 55H
2AAAH 55H
2AAAH 55H
1. Address format A14-A0 (Hex),Address A15 can be VIL or VIH, but no other value, for the Command sequence.
2. WA = Program Word address
3. SAX for Sector-Erase; uses AMS-A11 address lines
BAX for Block-Erase; uses AMS-A15 address lines
AMS = Most significant address
AMS = A16 for SST32HF202, A17 for SST32HF402, and A18 for SST32HF802
4. The device does not remain in Software Product ID mode if powered down.
5. With AMS-A1 = 0; SST Manufacturer’s ID = 00BFH, is read with A0 = 0,
SST32HF202 Device ID = 2789H, is read with A0 = 1,
SST32HF402 Device ID = 2780H, is read with A0 = 1
SST32HF802 Device ID = 2781H, is read with A0 = 1.
6th Bus
Write Cycle
Addr1 Data
SAX3 30H
BAX3 50H
5555H 10H
T4.4 1209
Absolute Maximum Stress Ratings (Applied conditions greater than those listed under “Absolute Maximum
Stress Ratings” may cause permanent damage to the device. This is a stress rating only and functional operation
of the device at these conditions or conditions greater than those defined in the operational sections of this data
sheet is not implied. Exposure to absolute maximum stress rating conditions may affect device reliability.)
Operating Temperature . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . -20°C to +85°C
Storage Temperature . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . -65°C to +125°C
D. C. Voltage on Any Pin to Ground Potential . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . -0.5V to VDD+0.3V
Transient Voltage (<20 ns) on Any Pin to Ground Potential . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . -2.0V to VDD+2.0V
Package Power Dissipation Capability (TA = 25°C) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1.0W
Surface Mount Solder Reflow Temperature1 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 260°C for 10 seconds
Output Short Circuit Current2. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 50 mA
1. Excluding certain with-Pb 32-PLCC units, all packages are 260°C capable in both non-Pb and with-Pb solder versions.
Certain with-Pb 32-PLCC package types are capable of 240°C for 10 seconds; please consult the factory for the latest information.
2. Outputs shorted for no more than one second. No more than one output shorted at a time.
OPERATING RANGE
Range
Commercial
Extended
Ambient Temp
0°C to +70°C
-20°C to +85°C
VDD
2.7-3.3V
2.7-3.3V
AC CONDITIONS OF TEST
Input Rise/Fall Time . . . . . . . . . . . . . . . 5 ns
Output Load . . . . . . . . . . . . . . . . . . . . . CL = 30 pF
See Figures 16 and 17
©2005 Silicon Storage Technology, Inc.
9
S71209-06-000
5/05
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