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STV7617DU データシートの表示(PDF) - STMicroelectronics

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STV7617DU
ST-Microelectronics
STMicroelectronics ST-Microelectronics
STV7617DU Datasheet PDF : 17 Pages
1 2 3 4 5 6 7 8 9 10 Next Last
STV7617, STV7617D, STV7617U
ABSOLUTE MAXIMUM RATINGS
Symbol
Parameter
VCC
OUTi
Logic Supply (Pin 88)*
Output Pins (1 to 28, 36 to 40, 48 to 77, 99, 100)
VIN
VOUT
VPOUT
IPOUT
IDOUT
Tjmax
Toper
Tstg
Logic Input Voltage (Pins 84, 86, 87, 89, 90, 91, 92)*
Logic Output Voltage (Pin 85)*
Driver Output Voltage (scanning mode)
Driver Output Current (1) (4)
Diode Output Current (3) (4)
Junction Temperature
Operating Temperature
Storage Temperature
* In case of STV7617D
Value
-0.3, +7
-0.3, +100
-0.3, VCC +0.3
-0.3, VCC + 0.3
-0.3, +100
-100, +1 A
±700
+150
-20, +85
-20, +150
Unit
V
V
V
V
V
mA
mA
°C
°C
°C
THERMAL DATA
Symbol
Rth(j-a)
Tjoper
Rth(j-a)
Parameter
Junction-ambient Thermal Resistance (1)
Maximum Operating Junction (1)
Junction-ambient Thermal Resistance (5)
Value
20
125
40
Unit
°C/W
°C
°C/W
Note 1 For TQFP100 packaging and slug soldered on printed circuit board.
Note 2 Through one power output.
Note 3 Through all power outputs (see test diagram): with Power dissipation lower or equal than Ptot and Junction tem-
perature lower or equal than Tjmax and VPP = VSSP.
Note 4 These parameters are measured during ST’s internal qualification which includes temperature characterisation
on standard batches and on corners batches of the process. These parameters are not tested on the parts.
Note 5 TQFP soldered on 4 layers Printed Circuit Board.
8/17
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