SX1231 データシートの表示（PDF） - Semtech Corporation

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コンポーネント説明

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SX1231

Low Power Integrated UHF Transceiver

Semtech Corporation 

SX1231

ADVANCED COMMUNICATIONS & SENSING

DATASHEET

5.5.2. Packet Format .......................................................................................................................................... 49

5.5.3. Tx Processing (without AES).................................................................................................................... 51

5.5.4. Rx Processing (without AES) ................................................................................................................... 52

5.5.5. AES .......................................................................................................................................................... 52

5.5.6. Handling Large Packets ........................................................................................................................... 54

5.5.7. Packet Filtering......................................................................................................................................... 54

5.5.8. DC-Free Data Mechanisms ...................................................................................................................... 56

6. Configuration and Status Registers ...................................................................................................................... 58

6.1. General Description ...................................................................................................................................... 58

6.2. Common Configuration Registers ................................................................................................................. 61

6.3. Transmitter Registers.................................................................................................................................... 64

6.4. Receiver Registers........................................................................................................................................ 65

6.5. IRQ and Pin Mapping Registers.................................................................................................................... 67

6.6. Packet Engine Registers............................................................................................................................... 69

6.7. Temperature Sensor Registers ..................................................................................................................... 72

6.8. Test Registers ............................................................................................................................................... 72

7. Application Information ......................................................................................................................................... 73

7.1. Crystal Resonator Specification .................................................................................................................... 73

7.2. Reset of the Chip .......................................................................................................................................... 73

7.2.1. POR.......................................................................................................................................................... 73

7.2.2. Manual Reset ............................................................................................................................................74

7.3. Reference Design ......................................................................................................................................... 74

8. Packaging Information .......................................................................................................................................... 76

8.1. Package Outline Drawing.............................................................................................................................. 76

8.2. Recommended Land Pattern ........................................................................................................................ 76

8.3. Thermal Impedance ...................................................................................................................................... 77

8.4. Tape & Reel Specification............................................................................................................................. 77

9. Chip Revisions ...................................................................................................................................................... 78

9.1. RC Oscillator Calibration............................................................................................................................... 78

9.2. Listen Mode................................................................................................................................................... 78

9.2.1. Resolutions............................................................................................................................................... 78

9.2.2. Exiting Listen Mode .................................................................................................................................. 79

9.3. OOK Floor Threshold Default Setting ........................................................................................................... 79

9.4. OCP Block..................................................................................................................................................... 79

9.5. AFC Control .................................................................................................................................................. 79

9.5.1. AfcAutoClearOn ....................................................................................................................................... 79

9.5.2. LowBetaAfcOn and LowBetaAfcOffset..................................................................................................... 79

10. Revision History .................................................................................................................................................... 80

Rev 3 - April 2010

Page 4

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