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TC1265 データシートの表示(PDF) - Microchip Technology

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TC1265
Microchip
Microchip Technology Microchip
TC1265 Datasheet PDF : 18 Pages
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TC1265
DC CHARACTERISTICS (CONTINUED)
Electrical Specifications: Unless otherwise indicated, VIN = VR + 1.5V, (Note 1), IL = 100 µA, CL = 3.3 µF,
SHDN > VIH, TA = +25°C. Boldface type specifications apply for junction temperatures of -40°C to +125°C.
Parameters
Sym
Min
Typ
Max
Units
Conditions
SHDN Input
SHDN Input High Threshold
SHDN Input Low Threshold
ERROR Output (SOIC Only)
VIH
45
%VIN
VIL
15
%VIN
Minimum Operating Voltage
VMIN
1.0
V
Output Logic Low Voltage
VOL
400
mV 1 mA Flows to ERROR
ERROR Threshold Voltage
VTH
0.95 x VR
V
ERROR Positive Hysteresis
VHYS
50
mV Note 8
Note
1: VR is the regulator output voltage setting.
2: The minimum VIN has to justify the conditions: VIN VR + VDROPOUT and VIN 2.7V for IL = 0.1 mA to IOUTMAX.
3: TCVOUT = (---V----O----U---T---M-----A--V-X---O-–--U---V-T--O--×--U---Δ-T---TM----I--N----)---–-----1---0---6-
4: Regulation is measured at a constant junction temperature using low duty cycle pulse testing. Load regulation is tested
over a load range from 0.1 mA to the maximum specified output current. Changes in output voltage due to heating effects
are covered by the thermal regulation specification.
5: Dropout voltage is defined as the input-to-output differential at which the output voltage drops 2% below its nominal value
measured at a 1.5V differential.
6: Thermal regulation is defined as the change in output voltage at a time T after a change in power dissipation is applied,
excluding load or line regulation effects. Specifications are for a current pulse equal to ILMAX at VIN = 6V for T = 10 ms.
7: The maximum allowable power dissipation is a function of ambient temperature, the maximum allowable junction temper-
ature and the thermal resistance from junction-to-air (i.e., TA, TJ, θJA). Exceeding the maximum allowable power dissipa-
tion causes the device to initiate thermal shutdown. Please see Section 5.0 “Thermal Considerations” for more details.
8: Hysteresis voltage is referenced to VR.
TEMPERATURE CHARACTERISTICS
Electrical Specifications: Unless otherwise indicated, VIN = VR + 1.5V, IL = 100 µA, CL = 3.3 µF,
SHDN > VIH, TA = +25°C.
Parameters
Sym
Min
Typ
Max
Units
Conditions
Temperature Ranges
Specified Temperature Range
Operating Temperature Range
Storage Temperature Range
Thermal Package Resistances
TA
-40
+125
°C (Note 1)
TJ
-40
+125
°C
TA
-65
+150
°C
Thermal Resistance, 5L-DDPAK
θJA
57
°C/W
Thermal Resistance, 5L-TO-220
θJA
71
°C/W
Thermal Resistance, 8L-SOIC
θJA
163
°C/W
Note 1: Operation in this range must not cause TJ to exceed Maximum Junction Temperature (+125°C).
© 2006 Microchip Technology Inc.
DS21376D-page 3

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