TC72(2011) データシートの表示（PDF） - Microchip Technology
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TC72 Datasheet PDF : 28 Pages
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TC72
3.0 PIN DESCRIPTION
Pin functionalities are described in Table 3-1.
TABLE 3-1: PIN FUNCTION TABLE
TC72
3x3 DFN MSOP
Symbol
Function
1
1
NC No internal connection
2
3
SCK Serial Clock input
3
2
CE Chip Enable input, the device is selected when this input is high
4
4
GND Ground
5
6
SDI Serial Data input
6
5
SDO Serial Data output
7
7
NC No internal connection
8
8
VDD Power supply
9
—
EP Exposed pad (Ground)
3.1 No Connection (NC)
This pin is not internally connected to the die.
3.2 Serial Clock Input (SCK)
The SCK pin is an Input pin. All communication and
timing is relative to the signal on this pin. The clock is
generated by the host controller on the SPI bus (see
Section 4.3 “Serial Bus Interface”).
3.3 Chip Enable Input (CE)
The CE is a Chip Enable pin. This is an active high
input, therefore the device is enabled when CE is
toggled to VDD. Once the device is enabled, all serial
communication begins (see Section 4.3 “Serial Bus
Interface”).
3.7 Power Supply (VDD)
VDD is the Power pin. The operating voltage range, as
specified in the DC electrical specification table, is
applied on this pin.
3.8 Exposed Pad (EP)
There is an internal electrical connection between the
Exposed Thermal Pad (EP) and the GND pin; they can
be connected to the same potential on the Printed
Circuit Board (PCB). This provides better thermal
conduction from the PCB to the die.
3.4 Ground (GND)
The GND is the system Ground pin.
3.5 Serial Data Input (SDI)
The SDI is a Data Input pin, used to transmit data from
the host to the device (see Section 4.3 “Serial Bus
Interface”).
3.6 Serial Data Output (SDO)
The SDO is a Data Output pin, used to transmit data
from the device to the host (see Section 4.3 “Serial
Bus Interface”).
© 2011 Microchip Technology Inc.
DS21743B-page 9
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