TDA2008 データシートの表示（PDF） - STMicroelectronics
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TDA2008 Datasheet PDF : 9 Pages
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TDA2008
PRACTICAL CONSIDERATIONS
Printed circuit board
The layout shown in Fig. 2 is recommended. If
different layouts are used, the ground points of input
1 and input 2 must be well decoupled from the
ground of the output through which a rather high
current flows.
Assembly suggestion
No electrical insulation is needed between the
package and the heat-sink. Pin length should be as
short as possible. The soldering temperature must
not exceed 260°C for 12 seconds.
Application suggestions
The recommended component values are those
shown in the application circuits of Fig. 1. Different
values can be used. The following table is intended
to aid the car-radio designer.
Component
C1
Recommended
value
Purpo se
2.2µF
Input DC decoupling
C2
470µF
Ripple rejection.
C3
0.1µF
Supply by passing.
C4
1000µF
Output coupling.
C5
0.1µF
Frequency stability.
R1
(Gv - 1) • R2 Setting of gain. (*)
R2
2.2Ω
Setting of gain and
SVR.
R3
1Ω
Frequency stability.
(*) The closed loop gain must be higher than 26dB.
Larger than
recommended value
Degradation of SVR.
Smaller than
recommended value
Noise at switch-on,
switch-off
Degradation of SVR.
Danger of oscillation.
Higher low frequency
cutoff.
Danger of oscillation
at high frequencies
with inductive loads.
Increase of drain
current.
Danger of oscillation
at high frequencies
with inductive loads.
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