TDA7491HV13TR データシートの表示（PDF） - STMicroelectronics
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TDA7491HV13TR Datasheet PDF : 26 Pages
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Package information
5
Package information
TDA7491HV
In order to meet environmental requirements, ST offers these devices in ECOPACK®
packages. These packages have a Lead-free second level interconnect. The category of
second Level Interconnect is marked on the package and on the inner box label, in
compliance with JEDEC Standard JESD97. The maximum ratings related to soldering
conditions are also marked on the inner box label. ECOPACK is an ST trademark.
ECOPACK specifications are available at: http://www.st.com.
Figure 21. PowerSSO-36 package dimensions
D MI . M NI .
A 2.15
A 2 2 .1 5
a1 0
b 0.18
c 0.23
D (1) 10.10
E (1) 7 .4
e
e3
F
G
G1
H 10.1 0
h
k
L 0.55
M
N
O
Q
S
T
U
X
4.1
Y
6.5
mm
TYP.
0.5
8 .5
2.3
û
4.3
1.2
0.8
2.9
.65
1.0
M AX . MIN .
2.4 7 0.08 4
2.4 0 0.084
0.0 7 5 0
0.3 6 0.00 7
0.3 2 0.00 9
10 .50 0 .3 98
in c h
T YP. MAX.
0.097
0.09 4
0.00 3
0.014
0.012
0.413
7.6 0 .2 91
0.299
0.1 0
0 .06
1 0.5 0
0.4 0
0.9 0
10û
4 .7
7 .3
0.39 8
0.02 2
0.161
0.256
0 .0 19
0.335
0 .0 90
5û
0 .1 69
0 .0 47
0 .0 31
0 .1 14
0.144
0 .0 39
0.00 4
0 .0 02
0.413
0.01 6
0.035
1 0û
0 .1 85
0 .2 87
(1) "D” a n d“E" d on ot in clu de m ldo flash o rp ro rt u sio n sM o lfdla sh
o r por trusio n ssh a ll n oet xce e d 01 .5 m m pide er 0s( 0. 0 6”)
Outline and mechanical data
PooweerSrSO-36
exposed pad (or slug) down
16/26
G
L E A D C O P L A N A R IT Y
A
D
e
T
O
U
B
0 .1 M A B
b
e3
h x 4û5
Y
M
L
B O T T O M V IE W
7587 1 31 A
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