TGA2501 データシートの表示（PDF） - TriQuint Semiconductor
部品番号
コンポーネント説明
メーカー
TGA2501 Datasheet PDF : 11 Pages
| |||
Advance Product Information
April 5, 2006
TGA2501
Chip Assembly & Bonding Diagram
1uF or larger capacitors (not shown) should be on the gate and drain line.
GaAs MMIC devices are susceptible to damage from Electrostatic Discharge. Proper precautions should
be observed during handling, assembly and test.
9
TriQuint Semiconductor Texas Phone : (972)994 8465 Fax: (972)994 8504 Web: www.triquint.com
Share Link: 