Input TFN
Advance Product Information
April 5, 2006
TGA2505
Chip Assembly & Bonding Diagram
100pF
Vd
Off chip
R=10:
Off chip
C=0.1PF
Output TFN
Off chip
Vg
R=10:
Off chip
C=0.1PF
100pF
GaAs MMIC devices are susceptible to damage from Electrostatic Discharge. Proper precautions should
be observed during handling, assembly and test.
TriQuint Semiconductor Texas Phone : (972)994-8465 Fax: (972)994-8504 Web: www.triquint.com
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